公开(公告)号：US20060290366A1

公开(公告)日：2006-12-28

申请号：US11169598

申请日：2005-06-28

Applicant: Hon Kon ,  Daniel Dangelo

Inventor： Hon Kon ,  Daniel Dangelo

IPC: G01R31/02

CPC classification number: G01R31/2874

Abstract: An apparatus and method for monitoring temperatures of multiple electronic devices under test are described herein.

Abstract translation: 本文描述了用于监测被测试的多个电子设备的温度的装置和方法。

公开(公告)号：US20060002161A1

公开(公告)日：2006-01-05

申请号：US10882905

申请日：2004-06-30

Applicant: Daniel Dangelo ,  Todd Albertson ,  Hon Kon ,  Jin Pan

Inventor： Daniel Dangelo ,  Todd Albertson ,  Hon Kon ,  Jin Pan

IPC: H02M1/00

CPC classification number: G01R31/2879 ,  G01R31/2863 ,  G01R31/2874 ,  G01R31/2886

Abstract: The present application relates to apparatus and methods for burn-in and other diagnostics performed on integrated circuits. In one embodiment, the invention includes a plurality of sockets, each to hold an integrated circuit (IC), and coupling power to the respective IC from a remote power supply, a plurality of voltage detectors, each coupled to a socket to sense the voltage of the power coupled to the respective IC, and a plurality of remote voltage regulators, each coupled between the power supply and a respective socket, to receive the sensed voltage from the respective voltage detector and to adjust the voltage of the respective coupled power in accordance therewith.

Abstract translation: 本申请涉及在集成电路上执行的用于老化和其他诊断的装置和方法。 在一个实施例中，本发明包括多个插座，每个插座用于保持集成电路（IC），并且从远程电源（多个电压检测器）将功率耦合到相应的IC，每个电压检测器耦合到插座以感测电压 耦合到相应IC的功率，以及多个远程电压调节器，每个远程电压调节器分别耦合在电源和相应的插座之间，以从相应的电压检测器接收感测的电压，并根据相应的电压调节相应的耦合功率的电压 随之而来。