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公开(公告)号:US09061363B2
公开(公告)日:2015-06-23
申请号:US11478772
申请日:2006-07-03
申请人: Wayne E Voice , Richard C Dewes , Martin R Bache , Stephen J Tuppen , Hong G Lee , David K Aspinwall
发明人: Wayne E Voice , Richard C Dewes , Martin R Bache , Stephen J Tuppen , Hong G Lee , David K Aspinwall
CPC分类号: B23K3/0607 , B23H9/00 , B23K1/0056 , B23K1/008 , B23K1/20
摘要: The present method creates a relatively thin in situ brazing alloy layer upon first and second component edges which are brought together in order to create a component joint. This in situ brazing alloy layer is created by deposition of brazing elements, such as copper or nickel, from an electrical discharge cutting process electrode depletion utilized in order to cut the component edges, and then a subsequent brazing technique creates through interstitial migration between that brazing alloy layer and the underlying material substrate of the components a robust component joint wherein the in situ brazing alloy layer penetrates the respective component cut edge surface to only a limited depth such that the geometric effect is similarly limited, and the properties of the underlying component material structure are maintained.
摘要翻译: 本方法在第一和第二部件边缘上形成相对薄的原位钎焊合金层,这些合金层被聚集在一起以形成部件接头。 这种原位钎焊合金层是通过从用于切割部件边缘的放电切割工艺电极耗尽中的钎焊元件(例如铜或镍)沉积产生的,然后通过该钎焊之间的间隙迁移产生后续的钎焊技术 合金层和组件的下层材料基底是坚固的部件接头,其中原位钎焊合金层仅穿过相应的部件切割边缘表面,仅限于有限的深度,使得几何效应被类似地限制,并且下面的部件材料的性质 维护结构。