公开(公告)号：US20240286229A1

公开(公告)日：2024-08-29

申请号：US18585429

申请日：2024-02-23

申请人： PRINCE & IZANT, LLC

发明人： KRISTINA PAVLOVNA DYSHKO ,  WARREN MARTIN ANDRE MIGLIETTI

IPC分类号： B23K35/22 ,  B23K1/018 ,  B23K1/20 ,  B23K35/36

CPC分类号： B23K35/224 ,  B23K1/018 ,  B23K1/20 ,  B23K35/3602

摘要： Provided herein is a stop-off material for a brazing process. The stop-off material includes a solvent, a thickener, and magnesium oxide. About 5 weight percent to about 60 weight percent of the stop-off material comprises the magnesium oxide. The stop-off material is configured to be removed from a surface after heating and via air pressure.

公开(公告)号：US11951557B2

公开(公告)日：2024-04-09

申请号：US18053408

申请日：2022-11-08

申请人： General Electric Company

发明人： Ethan Conrad Schaeffer ,  James Scott Flanagan ,  James J. Murray, III ,  Archie L Swanner, Jr. ,  Logan Tyler Nelson

IPC分类号： B23K1/00 ,  B23K1/008 ,  B23K1/20 ,  B23K35/40 ,  B23P6/00 ,  G01N21/954 ,  B33Y80/00

CPC分类号： B23K1/0018 ,  B23K1/008 ,  B23K1/20 ,  B23K35/40 ,  B23P6/002 ,  G01N21/954 ,  B33Y80/00

摘要： A process of repairing a component includes identifying a void in a component; determining at least one approximate physical configuration of the void; inserting borescope into the component in order to view the void; providing a repair rod approximately equivalent to at least one of the least one approximate physical configuration of the void; inserting the repair rod into component; confirming insertion of the repair rod in the void; separating the repair rod to leave a repair plug in the void; and depositing braze paste over the repair plug in the void.

公开(公告)号：US11819915B2

公开(公告)日：2023-11-21

申请号：US15786964

申请日：2017-10-18

申请人： Murata Manufacturing Co., Ltd.

发明人： Seitaro Washizuka

IPC分类号： B22F1/00 ,  B23K20/00 ,  B23K35/26 ,  C22C13/00 ,  B23K1/20 ,  B23K35/30 ,  B23K20/16 ,  B22F7/06 ,  B23K1/19 ,  C22C9/05 ,  B23K35/02 ,  C22C13/02 ,  C22C9/06 ,  B23K1/00 ,  B23K20/02 ,  H05K3/34 ,  C22C9/00 ,  B23K101/42

CPC分类号： B22F1/09 ,  B22F7/064 ,  B23K1/0002 ,  B23K1/0016 ,  B23K1/19 ,  B23K1/20 ,  B23K20/00 ,  B23K20/026 ,  B23K20/16 ,  B23K35/025 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/302 ,  C22C9/00 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K3/34 ,  H05K3/3457 ,  B22F2998/10 ,  B22F2999/00 ,  B23K2101/42 ,  H05K2203/0425 ,  B22F2999/00 ,  B22F7/064 ,  B22F3/12 ,  B22F2998/10 ,  B22F7/064 ,  B22F2003/248 ,  C22C1/047 ,  B22F2999/00 ,  B22F1/09 ,  B22F1/10 ,  B22F3/12 ,  B22F2999/00 ,  B22F3/12 ,  B22F1/09 ,  B22F1/10

摘要： A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

公开(公告)号：US11813689B2

公开(公告)日：2023-11-14

申请号：US17776463

申请日：2020-12-15

申请人： KME Germany GmbH

发明人： Marc Kovermann ,  Ralph Närdemann

IPC分类号： B23K1/20 ,  B21C23/18 ,  B21D22/04 ,  B23K3/08 ,  B23K31/02 ,  B23K33/00 ,  B23K101/18

CPC分类号： B23K1/20 ,  B21C23/186 ,  B21D22/04 ,  B23K3/08 ,  B23K31/02 ,  B23K33/00 ,  B23K2101/18

摘要： in a method for producing a solder deposit in a metal sheet, a depression is made in a topside of the metal sheet through deep drawing, thereby causing material to protrude on a bottom side of the metal sheet. The metal sheet is then subjected to a material forming process to produce a collar such that the collar projects in relation to the topside. The collar is then at least partially pressed in a direction of the depression to reduce a cross-sectional area of a mouth of the depression, and the protruding material on the bottom side is completely pushed back so that the bottom side in a region of the depression is in one plane with neighboring regions of the bottom side.

公开(公告)号：US20230347436A1

公开(公告)日：2023-11-02

申请号：US18347662

申请日：2023-07-06

申请人： WATLOW ELECTRIC MANUFACTURING COMPANY

发明人： Michael PARKER ,  Alfred Grant ELLIOT ,  Brent Donald Alfred ELLIOT ,  Frank BALMA ,  Richard Erich SCHUSTER ,  Dennis George REX ,  Alexander VEYTSER

IPC分类号： B32B18/00 ,  B32B9/00 ,  B23K35/28 ,  B23K35/00 ,  B32B7/14 ,  H01L21/67 ,  H05B1/00 ,  B32B15/20 ,  B23K1/19 ,  B23K1/20 ,  H01L21/687 ,  B23K1/00 ,  C04B35/645 ,  F16B9/00 ,  B32B3/30 ,  C04B37/00 ,  B32B9/04 ,  H01L21/683

CPC分类号： B23K1/0008 ,  B23K1/0016 ,  B23K1/19 ,  B23K1/20 ,  B23K35/005 ,  B23K35/286 ,  B32B3/30 ,  B32B7/14 ,  B32B9/005 ,  B32B9/04 ,  B32B9/041 ,  B32B15/20 ,  B32B18/00 ,  C04B35/645 ,  C04B37/001 ,  C04B37/006 ,  F16B9/00 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/68757 ,  H01L21/68785 ,  H05B1/00 ,  B23K2103/10 ,  C04B2237/84 ,  Y10T403/46 ,  Y10T428/31504 ,  Y10T428/31678

摘要： An electrostatic chuck includes a ceramic top plate layer made of a beryllium oxide material, a ceramic bottom plate layer made of a beryllium oxide material, a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer, an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer, and a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer. The electrode layer joins and hermetically seals the ceramic top plate layer to the ceramic middle plate layer, and the heater layer joins and hermetically seals the ceramic middle plate layer to the ceramic bottom plate layer.

公开(公告)号：US20190232409A1

公开(公告)日：2019-08-01

申请号：US16312099

申请日：2017-06-26

申请人： John James Barry

发明人： John James Barry

IPC分类号： B23K1/00 ,  B23K1/20

CPC分类号： B23K1/0008 ,  B23K1/19 ,  B23K1/20 ,  B23K20/026 ,  B23K20/227 ,  B23K20/24 ,  B23K31/025 ,  B23K2101/20 ,  B23K2103/18 ,  B23K2103/50

摘要： The disclosure relates to bonded assemblies (89) and a method of manufacture of such bonded assemblies (89). A such bonded assembly (89) has low residual stress and includes an inner body (91) having a substantially conical form, an outer body (90) having a substantially conical recess and a bonding region; whereby the conical form is in a first material having a thermal expansion coefficient al and the conical recess is in a second material having a thermal expansion coefficient a2 whereby al is not equal to a2; whereby said conical form includes an axis (31) extending in an axial direction and is substantially concentric with said conical recess; said bonding region including at least a third material having a plurality of grains and with an alignment of said grains relative to the generatrices of said conical form and said conical recess; said related method including an axial displacement of said inner body (91) relative to said outer body (90) simultaneous with cooling of said bonded assembly (89) from an elevated temperature to a low or ambient temperature.

公开(公告)号：US20190099885A1

公开(公告)日：2019-04-04

申请号：US16143116

申请日：2018-09-26

申请人： Hakko Corporation

发明人： Yoshitomo TERAOKA ,  Satoshi MANDA

IPC分类号： B25J9/16 ,  B25J11/00 ,  B23K1/16

CPC分类号： B25J9/1664 ,  B23K1/0016 ,  B23K1/16 ,  B23K1/19 ,  B23K1/20 ,  B23K3/02 ,  B23K3/0615 ,  B23K3/063 ,  B23K3/08 ,  B23K2101/42 ,  B25J11/005 ,  H04B1/06

摘要： A soldering apparatus is provided with a soldering iron for soldering with a tip, a driving portion for moving the soldering iron, a storage portion that stores position information indicating a soldering position and identification information associated each other, a reading portion that reads target identification information attached to the work target, an acquiring portion that acquires position information in the storage portion matching the target identification information read by the reading portion, and a process control portion for controlling the driving portion and the soldering iron so as to perform soldering at the position indicated by the position information acquired by the acquiring portion.

公开(公告)号：US20180348258A1

公开(公告)日：2018-12-06

申请号：US16101643

申请日：2018-08-13

申请人： Endress+Hauser Conducta GmbH+Co. KG

发明人： Stephan Buschnakowski ,  Alexander Serfling

IPC分类号： G01R1/073 ,  G01N27/07 ,  B23K1/00

CPC分类号： G01R1/073 ,  B23K1/0016 ,  B23K1/20 ,  B23K2101/38 ,  B32B37/1284 ,  G01N27/07

摘要： The present disclosure discloses a conductivity sensor including a basic body of sintered ceramic having at least two cavities disposed on a frontal face and a metal electrodes disposed in each cavity. Each electrode is about one fifth the length of the basic body. Electrical cables extend from a rear face of the basic body into holes in each cavity and contact the electrodes. A solder paste or an electrically conductive adhesive disposed in each hole connects each cable with the respective metal electrode electrically and mechanically.

公开(公告)号：US20180301377A9

公开(公告)日：2018-10-18

申请号：US15423602

申请日：2017-02-03

申请人： KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

发明人： Sehoon Yoo ,  Chang Woo LEE ,  Jun Ki KIM ,  Jeong Han KIM ,  Young Ki KO

IPC分类号： H01L21/768 ,  H01L23/48 ,  B23K1/00 ,  B23K3/06

CPC分类号： H01L21/76898 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/06 ,  B23K3/0646 ,  B23K3/087 ,  B23K2101/40 ,  H01L23/481

摘要： A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

公开(公告)号：US10076800B2

公开(公告)日：2018-09-18

申请号：US14954243

申请日：2015-11-30

申请人： Cree Fayetteville, Inc.

发明人： Jennifer Stabach ,  Brice McPherson ,  Chad B. O'Neal

IPC分类号： B23K31/02 ,  B23K1/20 ,  B23K1/00 ,  B23K26/362 ,  H01L23/13 ,  H05K3/02 ,  H05K1/02 ,  H05K3/24 ,  H05K3/34

CPC分类号： B23K1/20 ,  B23K1/0016 ,  B23K26/361 ,  B23K26/362 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/49894 ,  H01L2224/32225 ,  H05K1/0263 ,  H05K3/027 ,  H05K3/243 ,  H05K3/341 ,  H05K2201/09363 ,  H05K2203/0315 ,  H05K2203/1173

摘要： A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.