公开(公告)号：US20110315356A1

公开(公告)日：2011-12-29

申请号：US12822294

申请日：2010-06-24

申请人： George Anthony. Meyer, IV ,  Chien-Hung Sun ,  Chieh-Ping Chen ,  Hsien-Tsang Liu

发明人： George Anthony. Meyer, IV ,  Chien-Hung Sun ,  Chieh-Ping Chen ,  Hsien-Tsang Liu

IPC分类号： F28F13/00 ,  F28F7/00

CPC分类号： H01L23/467 ,  F28D15/0233 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat-dissipating device includes a heat-dissipating body, a vapor chamber and a fan assembly. The heat-dissipating body includes a thermal-conductive element and a radial fin assembly. The thermal-conductive element includes a solid post and extending arms extending therefrom. The radial fin assembly includes radially-arranged heat-dissipating fins that form a central hole to enclose the sold post, engaging troughs inserted by the extending arms, and an airflow space. An air channel is formed between any two heat-dissipating fins. The vapor chamber is provided at one end of the solid post, while the fan assembly is arranged on the other end and received in the airflow space to correspond to the respective air channels. Thus, the mobility of air and the heat-dissipating efficiency can be increased, thereby conforming to the requirements for compact design.

摘要翻译： 散热装置包括散热体，蒸气室和风扇组件。 散热体包括导热元件和径向翅片组件。 导热元件包括固体柱和从其延伸的延伸臂。 径向翅片组件包括径向布置的散热翅片，其形成用于封闭销售柱的中心孔，由延伸臂插入的接合槽和气流空间。 在任何两个散热翅片之间形成空气通道。 蒸气室设置在固体柱的一端，而风扇组件布置在另一端并且容纳在气流空间中以对应于相应的空气通道。 因此，可以提高空气的流动性和散热效率，从而符合紧凑设计的要求。

公开(公告)号：US06771498B2

公开(公告)日：2004-08-03

申请号：US10280726

申请日：2002-10-25

申请人： Hwai-Ming Wang ,  Wei-Chieh Chiang ,  Hsien-Tsang Liu

发明人： Hwai-Ming Wang ,  Wei-Chieh Chiang ,  Hsien-Tsang Liu

IPC分类号： G06F120

CPC分类号： G06F1/203 ,  G06F2200/203

摘要： A cooling system for a hinged portable computing device is provided having a first passive heat transfer device is carried within a first housing portion of the computer and a second passive heat transfer device that is carried within a second housing portion of the portable computer. A hinge structure interconnects the first and second housing portions for pivotal movement relative to one another, where the hinge structure includes a heat conductive first gudgeon having a pintle and a thermal interface block. The thermal interface block is disposed in the second housing portion and connected in thermal communication with the second first passive heat transfer device. A heat conductive second gudgeon is also provided having a journal and a thermal interface block. The thermal interface block of the second gudgeon is connected in thermal communication with the first passive heat transfer device, and the pintle is rotatably received within the journal so as to be in heat exchange relationship with the second gudgeon, thereby forming an integral portion of the hinge structure. In one embodiment, a third passive heat transfer device is also employed within the first housing portion of the computer.

公开(公告)号：US08059406B1

公开(公告)日：2011-11-15

申请号：US12818268

申请日：2010-06-18

申请人： George Anthony Meyer, IV ,  Chien-Hung Sun ,  Chieh-Ping Chen ,  Hsien-Tsang Liu

发明人： George Anthony Meyer, IV ,  Chien-Hung Sun ,  Chieh-Ping Chen ,  Hsien-Tsang Liu

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0233 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a memory device and its heat sink, the memory device includes a memory, a heat sink mounted onto the memory and a clamping element, and the heat sink includes an isothermal vapor chamber plate and a heat dissipating body, and the isothermal vapor chamber plate is attached onto an external side of the memory and includes an insert portion, and the heat dissipating body includes a base plate, a plurality of heat dissipating fins extended from the base plate, and a pawl arm extended from the base plate and in an opposite direction of the fins, and the heat dissipating body is coupled to the insert portion in a replaceable manner by the pawl arm, and the clamping element is provided for clamping the base plate and the isothermal vapor chamber plate, such that the heat dissipating body can be replaced on the isothermal vapor chamber plate easily.

摘要翻译： 在存储器件及其散热器中，存储器件包括存储器，安装在存储器上的散热器和夹紧元件，散热器包括等温蒸气室板和散热体，以及等温蒸气室板 附接到存储器的外侧，并且包括插入部分，并且散热体包括基板，从基板延伸的多个散热翅片和从基板延伸的棘爪臂，并且在相对的 鳍片的方向和散热体通过棘爪臂以可更换的方式联接到插入部分，并且夹紧元件被设置用于夹紧基板和等温蒸气室板，使得散热体可以 在等温蒸汽室板上更换。

公开(公告)号：US08134834B2

公开(公告)日：2012-03-13

申请号：US12818341

申请日：2010-06-18

申请人： George Anthony Meyer, IV ,  Chien-Hung Sun ,  Chieh-Ping Chen ,  Hsien-Tsang Liu

发明人： George Anthony Meyer, IV ,  Chien-Hung Sun ,  Chieh-Ping Chen ,  Hsien-Tsang Liu

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  F28F1/20 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A clamp-type heat sink for a memory includes two heat conducting modules, a pivot shaft, and an elastic element. The heat conducting module includes an isothermal vapor chamber plate and a heat dissipating body coupled to the isothermal vapor chamber plate. The heat dissipating body includes a base plate and heat dissipating fins extended from the base plate. The base plate includes a shaft hole for passing the pivot shaft, such that each heat dissipating body is installed serially, and the elastic element is sheathed onto the pivot shaft and includes two elastic arms extended from the elastic element and abutted against each heat dissipating body, such that each isothermal vapor chamber plate is clamped and attached onto an external side of the memory to improve the convenience and integrity of the assembling and removal process to achieve a quick assembling or removal effect and prevent the components from missing.

摘要翻译： 用于存储器的夹式散热器包括两个导热模块，枢转轴和弹性元件。 导热模块包括等温蒸气室板和耦合到等温蒸气室板的散热体。 散热体包括基板和从基板延伸的散热片。 基板包括用于使枢轴穿过的轴孔，使得每个散热体串联安装，并且弹性元件被套在枢轴上，并且包括从弹性元件延伸并抵靠每个散热体的两个弹性臂 使得每个等温蒸气室板被夹紧并附接到存储器的外部侧，以提高组装和移除过程的便利性和完整性，以实现快速组装或去除效果并防止部件丢失。

公开(公告)号：US20110310563A1

公开(公告)日：2011-12-22

申请号：US12818341

申请日：2010-06-18

申请人： George Anthony Meyer, IV ,  Chien-Hung Sun ,  Chieh-Ping Chen ,  Hsien-Tsang Liu

发明人： George Anthony Meyer, IV ,  Chien-Hung Sun ,  Chieh-Ping Chen ,  Hsien-Tsang Liu

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  F28F1/20 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A clamp-type heat sink for a memory includes two heat conducting modules, a pivot shaft, and an elastic element. The heat conducting module includes an isothermal vapor chamber plate and a heat dissipating body coupled to the isothermal vapor chamber plate. The heat dissipating body includes a base plate and heat dissipating fins extended from the base plate. The base plate includes a shaft hole for passing the pivot shaft, such that each heat dissipating body is installed serially, and the elastic element is sheathed onto the pivot shaft and includes two elastic arms extended from the elastic element and abutted against each heat dissipating body, such that each isothermal vapor chamber plate is clamped and attached onto an external side of the memory to improve the convenience and integrity of the assembling and removal process to achieve a quick assembling or removal effect and prevent the components from missing.

摘要翻译： 用于存储器的夹式散热器包括两个导热模块，枢转轴和弹性元件。 导热模块包括等温蒸气室板和耦合到等温蒸气室板的散热体。 散热体包括基板和从基板延伸的散热片。 基板包括用于使枢轴穿过的轴孔，使得每个散热体串联安装，并且弹性元件被套在枢轴上，并且包括从弹性元件延伸并抵靠每个散热体的两个弹性臂 使得每个等温蒸气室板被夹紧并附接到存储器的外部侧，以提高组装和移除过程的便利性和完整性，以实现快速组装或去除效果并防止部件丢失。