公开(公告)号：US20050252679A1

公开(公告)日：2005-11-17

申请号：US10844959

申请日：2004-05-13

Applicant: Hsing-Hua Chang ,  Mario Perez ,  C. Guilbert

Inventor： Hsing-Hua Chang ,  Mario Perez ,  C. Guilbert

IPC: C08L23/08 ,  C08L67/00 ,  C08L67/02 ,  H01B3/42 ,  H01B3/44 ,  H01B7/02 ,  H01B7/00

CPC classification number: H01B3/421 ,  C08L23/0884 ,  C08L67/00 ,  C08L67/02 ,  H01B3/441 ,  C08L33/00 ,  C08L2666/06

Abstract: Disclosed is a multi-layer insulated wire comprising a conductor and one or more insulating layers covering the conductor, wherein the one or more insulating layers are prepared from a composition comprising: (A) 100 parts by weight of a thermoplastic polyester-series resin, and (B) from 1 to 70 parts by weight of an ethylene-series polymer having epoxy and acrylate groups. Also disclosed are a process for preparing the multi-layer insulated wire and electronic devices, such as transformers, comprising the multi-layer insulated wire.

Abstract translation: 公开了一种多层绝缘线，其包括导体和覆盖导体的一个或多个绝缘层，其中所述一个或多个绝缘层由组合物制备，所述组合物包含：（A）100重量份的热塑性聚酯系树脂， 和（B）1〜70重量份的具有环氧基和丙烯酸酯基团的乙烯系聚合物。 还公开了一种制备包括多层绝缘线的多层绝缘线和电子器件（例如变压器）的方法。