公开(公告)号：US4906342A

公开(公告)日：1990-03-06

申请号：US340491

申请日：1989-04-19

申请人： Setsuko Takahashi ,  Isao Saeki ,  Shoichiro Mori ,  Ida Kazuhiko

发明人： Setsuko Takahashi ,  Isao Saeki ,  Shoichiro Mori ,  Ida Kazuhiko

IPC分类号： C25D3/44 ,  C25D3/66

CPC分类号： C25D3/665 ,  C25D3/44

摘要： In the plating for electrodeposition of aluminum using a non-aqueous solution, a plating bath is prepared to comprise a low-melting plating bath, which comprises a molten mixture comprising an aluminum halide and a dialkyl-and/or trialkylpyridinium halide represented by the following formula: ##STR1## wherein R.sup.1 represents an alkyl group having 1 to 12 carbon atoms, R.sup.2 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R.sup.3 represents an alkyl group having 1 to 6 carbon atoms, and X represents a halogen atom; and said alkyl groups each refer to a straight-chain hydrocarbon group, a branched hydrocarbon group, an alicyclic hydrocarbon group, or any of these further partly containing an aromatic hydrocarbon group,by which the bath life, operability in handling, conductivity, and current efficiency can be improved.