Method and Apparatus for Plating Metal and Metal Oxide Layer Cores

    公开(公告)号:US20230082177A1

    公开(公告)日:2023-03-16

    申请号:US17900803

    申请日:2022-08-31

    申请人: Atlas Magnetics

    摘要: An apparatus and method for plating magnetic cores by periodically transferring a plate directly back and forth between a metal plating environment and an insulation deposit environment. This direct metal to insulation to metal plating is enabled by a nano-scale insulation layer that provides an imperfect coverage of the metal layer while still keeping sufficient insulation to prevent eddy current formation—even during high-frequency current applications. Therefore, this invention enables the practical creation of magnetic cores having layers with widths even under one nanometer and can generate cores having a layer scale that can be varied to suit a variety of uses in the microelectronic industry.

    SOLAR CELLS FORMED VIA ALUMINUM ELECTROPLATING

    公开(公告)号:US20190312162A1

    公开(公告)日:2019-10-10

    申请号:US16432702

    申请日:2019-06-05

    摘要: Electroplating of aluminum may be utilized to form electrodes for solar cells. In contrast to expensive silver electrodes, aluminum allows for reduced cell cost and addresses the problem of material scarcity. In contrast to copper electrodes which typically require barrier layers, aluminum allows for simplified cell structures and fabrication steps. In the solar cells, point contacts may be utilized in the backside electrodes for increased efficiency. Solar cells formed in accordance with the present disclosure enable large-scale and cost-effective deployment of solar photovoltaic systems.