公开(公告)号：US08507838B2

公开(公告)日：2013-08-13

申请号：US12940366

申请日：2010-11-05

申请人： Hugh Robert Andrews ,  Edward T. H. Clifford ,  Marius Emanuel Facina ,  Harry Ing ,  Vernon Theodore Koslowsky ,  Darren Adam Locklin ,  Martin Bernard Smith ,  Irina Stefania Stefanescu

发明人： Hugh Robert Andrews ,  Edward T. H. Clifford ,  Marius Emanuel Facina ,  Harry Ing ,  Vernon Theodore Koslowsky ,  Darren Adam Locklin ,  Martin Bernard Smith ,  Irina Stefania Stefanescu

IPC分类号： H01J40/14 ,  H01J43/06

CPC分类号： H01J43/22

摘要： The Microstructure Photomultiplier Assembly (MPA) enables the effective conversion of light signals (received at the front of the assembly) into readily-detectable electrical signals. The MPA comprises a photocathode, followed by an electron-multiplying plate(s) made from an insulating substrate which does not emit sufficient contaminants to poison the photocathode. Each plate is coated with a conductive layer. The front face of each plate is further coated with a layer of secondary electron-emissive material which, when struck by an incoming electron, can produce secondary electrons. Each plate is perforated with channels. The channels are designed to promote the efficient transfer and acceleration of electrons through the channels, under an applied voltage differential across the plate(s). An anode (pixelated or non-pixelated) at the end of the last plate collects the electrons and generates an electrical signal. The MPA is contained within a vacuum enclosure.

摘要翻译： 微结构光电倍增器组件（MPA）可以将光信号（在组件前面接收）有效转换成易于检测的电信号。 MPA包括光电阴极，随后是由绝缘基板制成的电子倍增板，其不会发出足够的污染物来中和光电阴极。 每个板涂有导电层。 每个板的前表面进一步涂覆有一层二次电子发射材料，当被入射的电子撞击时，其可以产生二次电子。 每个板都穿孔。 这些通道被设计用于在穿过该板的施加的电压差下促进电子通过通道的有效传递和加速。 在最后一个板的末端的阳极（像素化或非像素化）收集电子并产生电信号。 MPA包含在真空外壳内。

公开(公告)号：US20110133055A1

公开(公告)日：2011-06-09

申请号：US12940366

申请日：2010-11-05

申请人： Hugh Robert Andrews ,  Edward T.H. Clifford ,  Marius Emanuel Facina ,  Harry Ing ,  Vernon Theodore Koslowsky ,  Darren Adam Locklin ,  Martin Bernard Smith ,  Irina Stefania Stefanescu

发明人： Hugh Robert Andrews ,  Edward T.H. Clifford ,  Marius Emanuel Facina ,  Harry Ing ,  Vernon Theodore Koslowsky ,  Darren Adam Locklin ,  Martin Bernard Smith ,  Irina Stefania Stefanescu

IPC分类号： H01J40/14

CPC分类号： H01J43/22

摘要： The subject invention provides for a novel photomultiplier assembly, termed the Microstructure Photomultiplier Assembly (MPA), which enables the effective conversion of light signals (received at the front of the assembly) into readily-detectable electrical signals. The MPA comprises a photocathode (which converts light into electrons and which is located in front of or on the front surface of the assembly), followed by an electron-multiplying plate, or series of plates, each made from an insulating substrate which does not emit sufficient contaminants to poison the photocathode. Each plate is coated on the front and rear faces with a conductive layer. In addition, the front face of each plate is further coated with a layer of secondary electron-emissive material which, when struck by an incoming electron, can produce secondary electrons. Each plate is perforated with channels (with non-conducting walls) and the number and geometry of these channels is designed to promote the efficient transfer and acceleration of electrons through the channel, under an applied voltage differential across the plate(s). The number of plates placed in series is determined by the desired degree of electron multiplication. At the exit of the last plate, an anode is located to collect the electrons and generate an electrical signal that can be read by conventional electronics. The anode can be a simple anode or can be a position-sensitive anode. The spacing between the photocathode, the electron-multiplying plates, and the anode is selected to promote the efficient transfer and acceleration of electrons across the assembly, as well as to promote the efficient production of secondary electrons. The photocathode, electron-multiplying plate(s) and anode are all contained within a vacuum enclosure.

摘要翻译： 本发明提供了一种称为微结构光电倍增器组件（MPA）的新型光电倍增器组件，其能够将光信号（在组件的前面接收）有效转换成易于检测的电信号。 MPA包括光电阴极（其将光转换成电子并且位于组件的前表面之前或之后），随后是电绝缘基板制成的电子倍增板或一系列板 发出足够的污染物来中毒光电阴极。 每个板在前表面和后表面上涂覆有导电层。 此外，每个板的前表面进一步涂覆有二次电子发射材料层，当被入射的电子撞击时，它可以产生二次电子。 每个板都穿过通道（具有非导电壁），并且这些通道的数量和几何形状被设计成通过穿过板的施加的电压差促进电子通过通道的有效传递和加速。 串联放置的板的数量由所需的电子倍增程度决定。 在最后一个板的出口处，阳极被定位成收集电子并产生可由常规电子器件读取的电信号。 阳极可以是简单的阳极，也可以是位置敏感的阳极。 选择光电阴极，电子倍增板和阳极之间的间隔，以促进电子跨过组件的有效转移和加速，以及促进二次电子的有效生产。 光电阴极，电子倍增板和阳极都包含在真空外壳内。