公开(公告)号：US07001253B2

公开(公告)日：2006-02-21

申请号：US10801316

申请日：2004-03-16

申请人： Renjie Zhou ,  Steven K. Grumbine ,  Issac K. Cherian

发明人： Renjie Zhou ,  Steven K. Grumbine ,  Issac K. Cherian

IPC分类号： B24B1/00

CPC分类号： B24B37/24 ,  B24B37/245 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/3212 ,  Y10T156/1051

摘要： The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, and either boric acid, or a conjugate base thereof, wherein the boric acid and conjugate base are not present together in the polishing system in a sufficient amount to act as a pH buffer, or a water-soluble boron-containing compound, or salt thereof, that is not boric acid, and a method of polishing a substrate using the chemical-mechanical polishing system.