公开(公告)号：US06471464B1

公开(公告)日：2002-10-29

申请号：US09415556

申请日：1999-10-08

申请人： Richard Fay ,  Paul Peng ,  Wei Chen ,  Gino Tsai ,  J Fan Chang

发明人： Richard Fay ,  Paul Peng ,  Wei Chen ,  Gino Tsai ,  J Fan Chang

IPC分类号： B65G4907

CPC分类号： H01L21/681 ,  Y10S414/136

摘要： A device for orienting and/or centering a wafer is provided. The device employs a CCD camera and backlighting source which enhances the CCD camera's ability to detect wafer position. The backlighting source may be positioned along the side of the wafer opposite the CCD camera, or may be positioned adjacent the CCD camera. When positioned adjacent the CCD camera one or more shields are employed to prevent direct or reflected light from impacting the top surface of the wafer being detected by the CCD camera. Accordingly the only light detected by the CCD camera is light which passes the wafer and reflects from a surface therebeyond, back to the CCD camera, resulting in effective backlighting of the wafer. The image of the wafer may be further sharpened by roughening the surface from which light reflects back to CCD camera.

摘要翻译： 提供了用于定向和/或定心晶片的装置。 该设备采用CCD摄像机和背光源，增强了CCD摄像机检测晶片位置的能力。 背光源可以沿着与CCD相机相对的晶片的侧面定位，或者可以位于CCD相机附近。 当定位在CCD相机附近时，使用一个或多个屏蔽来防止直接或反射的光撞击由CCD照相机检测到的晶片的顶表面。 因此，CCD相机检测到的唯一光线是通过晶片并从其表面反射回CCD相机的光，导致晶片的有效背光。 通过粗糙化光反射回CCD相机的表面，晶片的图像可以进一步削尖。