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6 条记录 (耗时 0.012 秒)

    Process strength indicator
    2.
    发明授权
    Process strength indicator 失效
    工艺强度指示器

    公开(公告)号：US06304121B1

    公开(公告)日：2001-10-16

    申请号：US09543404

    申请日：2000-04-05

    申请人： Paul Peng-Sheng Wang

    发明人： Paul Peng-Sheng Wang

    IPC分类号： H03K512

    CPC分类号： H03K5/13 ,  H03K2005/00032 ,  H03K2005/00123 ,  H03K2005/00143

    摘要： A method and apparatus for dynamically evaluating the behavior of semiconductor devices in an integrated circuit and for providing an adjusted output is disclosed. In one configuration the method and apparatus disclosed herein is configured as a compensation system and comprises a detection subsystem and a switching subsystem. The detection subsystem is configured to receive a signal generated by one or more semiconductor devices and detect the magnitude of the received signal. Depending on desired system parameters, the magnitude of the received signal causes one or more semiconductor devices to conduct an output signal to a switching subsystem. In one configuration, a plurality of signals travel from the detection subsystem to the switching subsystem. The switching subsystem is configured to receive the signal(s) from the detection subsystem and generate a voltage or current having magnitude related to the input received from the detection subsystem. In one configuration the switching subsystem comprises a plurality of devices configured to conduct current when presented with a signal from the detection subsystem. In a dynamic manner, the present invention can adapt output to compensate for changes in device behavior resulting from temperature change and variation in process parameters during manufacture. In various other embodiments, interface may be made with a processor or other control apparatus to further supplement device behavior.

    摘要翻译： 公开了用于动态地评估集成电路中的半导体器件的行为并提供调整的输出的方法和装置。 在一种配置中，本文公开的方法和装置被配置为补偿系统，并且包括检测子系统和交换子系统。 检测子系统被配置为接收由一个或多个半导体器件产生的信号并检测接收信号的幅度。 根据期望的系统参数，接收信号的幅度使得一个或多个半导体器件将输出信号传导到交换子系统。 在一种配置中，多个信号从检测子系统传送到交换子系统。 交换子系统被配置为从检测子系统接收信号，并产生具有与从检测子系统接收的输入相关的幅度的电压或电流。 在一个配置中，交换子系统包括被配置成当呈现来自检测子系统的信号时传导电流的多个设备。 以动态的方式，本发明可以适应输出以补偿由制造过程中温度变化和工艺参数变化引起的器件行为的变化。 在各种其他实施例中，可以用处理器或其他控制装置进行接口以进一步补充设备行为。

    Wafer positioning device
    5.
    发明授权
    Wafer positioning device 失效
    晶圆定位装置

    公开(公告)号：US06471464B1

    公开(公告)日：2002-10-29

    申请号：US09415556

    申请日：1999-10-08

    申请人： Richard Fay ,  Paul Peng ,  Wei Chen ,  Gino Tsai ,  J Fan Chang

    发明人： Richard Fay ,  Paul Peng ,  Wei Chen ,  Gino Tsai ,  J Fan Chang

    IPC分类号： B65G4907

    CPC分类号： H01L21/681 ,  Y10S414/136

    摘要： A device for orienting and/or centering a wafer is provided. The device employs a CCD camera and backlighting source which enhances the CCD camera's ability to detect wafer position. The backlighting source may be positioned along the side of the wafer opposite the CCD camera, or may be positioned adjacent the CCD camera. When positioned adjacent the CCD camera one or more shields are employed to prevent direct or reflected light from impacting the top surface of the wafer being detected by the CCD camera. Accordingly the only light detected by the CCD camera is light which passes the wafer and reflects from a surface therebeyond, back to the CCD camera, resulting in effective backlighting of the wafer. The image of the wafer may be further sharpened by roughening the surface from which light reflects back to CCD camera.

    摘要翻译： 提供了用于定向和/或定心晶片的装置。 该设备采用CCD摄像机和背光源，增强了CCD摄像机检测晶片位置的能力。 背光源可以沿着与CCD相机相对的晶片的侧面定位，或者可以位于CCD相机附近。 当定位在CCD相机附近时，使用一个或多个屏蔽来防止直接或反射的光撞击由CCD照相机检测到的晶片的顶表面。 因此，CCD相机检测到的唯一光线是通过晶片并从其表面反射回CCD相机的光，导致晶片的有效背光。 通过粗糙化光反射回CCD相机的表面，晶片的图像可以进一步削尖。