公开(公告)号：US5210936A

公开(公告)日：1993-05-18

申请号：US817214

申请日：1992-01-06

Applicant: Richard L. Simmons ,  James D. Wehrly, Jr. ,  Michael J. Bertram

Inventor： Richard L. Simmons ,  James D. Wehrly, Jr. ,  Michael J. Bertram

IPC: H01L21/00 ,  H01L23/495

CPC classification number: H01L24/50 ,  H01L21/67144 ,  H01L23/49558 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/5149 ,  Y10T29/515

Abstract: The excise and lead form of TAB leads bonded to an integrated circuit chip. Leads extending beyond a sidewall are clamped between a first clamp and a form anvil at a first portion spaced from the chip. The leads are also clamped between an excise/form tool and a second clamp at a second portion spaced further from the chip than the first portion. An excise blade cuts the leads outside the second portion. Then the excise/form tool, second clamp and excise blade move downwards in a curved path toward the chip to form a first lead corner against the form anvil and a second lead corner against the excise/form tool without splaying or galling the leads.

Abstract translation: TAB引脚的切割和引线形式引线结合到集成电路芯片。 延伸超过侧壁的引线在与芯片间隔开的第一部分处夹在第一夹具和砧座之间。 在比第一部分更远离芯片的第二部分处，引线也夹在消费/成型工具和第二夹具之间。 切割刀将第二部分之外的引线切割。 然后，切割/成形工具，第二夹具和切割刀片以弯曲的路径向下移动朝向芯片，以形成抵抗砧座的第一引导角和抵靠消费/形成工具的第二引导角，而不会使引线绷直或磨损。

公开(公告)号：US5078852A

公开(公告)日：1992-01-07

申请号：US596790

申请日：1990-10-12

Applicant: Ian Y. K. Yee ,  James D. Wehrly, Jr.

Inventor： Ian Y. K. Yee ,  James D. Wehrly, Jr.

IPC: C25D17/08

CPC classification number: C25D17/08

Abstract: A plating rack for use in electroplating at least one substrate includes a rack body onto which the subtrate may be placed; a metal ring connected to the rack body so as to surround a substrate placed on the rack body; and bistable, single-tipped cam assemblies for holding a placed substrate in place and for making electrical contact between the metal ring and the substrate.

Abstract translation: 用于电镀至少一个基板的电镀架包括：搁板体，可在其上放置微量滴液; 金属环，连接到所述齿条体，以围绕放置在所述齿条体上的基底; 以及用于将放置的基板保持在适当位置并且用于在金属环和基板之间进行电接触的双稳态单头凸轮组件。

公开(公告)号：US5283946A

公开(公告)日：1994-02-08

申请号：US062876

申请日：1993-05-17

Applicant: Richard L. Simmons ,  James D. Wehrly, Jr. ,  Michael J. Bertram

Inventor： Richard L. Simmons ,  James D. Wehrly, Jr. ,  Michael J. Bertram

IPC: H01L21/00 ,  H01L23/495 ,  H01R43/00

CPC classification number: H01L24/50 ,  H01L21/67144 ,  H01L23/49558 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/5149 ,  Y10T29/515

Abstract: The excise and lead form of TAB leads bonded to an integrated circuit chip. Leads extending beyond a sidewall are clamped between a first clamp and a form anvil at a first portion spaced from the chip. The leads are also clamped between an excise/form tool and a second clamp at a second portion spaced further from the chip than the first portion. An excise blade cuts the leads outside the second portion. Then the excise/form tool, second clamp and excise blade move downwards in a curved path toward the chip to form a first lead corner against the form anvil and a second lead corner against the excise/form tool without splaying or galling the leads.

Abstract translation: TAB引脚的切割和引线形式引线结合到集成电路芯片。 延伸超过侧壁的引线在与芯片间隔开的第一部分处夹在第一夹具和砧座之间。 在比第一部分更远离芯片的第二部分处，引线也夹在消费/成型工具和第二夹具之间。 切割刀将第二部分之外的引线切割。 然后，切割/成形工具，第二夹具和切割刀片以弯曲的路径向下移动朝向芯片，以形成抵抗砧座的第一引导角和抵靠消费/形成工具的第二引导角，而不会使引线绷直或磨损。

公开(公告)号：US4945954A

公开(公告)日：1990-08-07

申请号：US414549

申请日：1989-09-28

Applicant: James D. Wehrly, Jr. ,  Michael J. Bertram

Inventor： James D. Wehrly, Jr. ,  Michael J. Bertram

IPC: B21D28/00 ,  B21D28/04 ,  B21D28/34 ,  B26F1/14 ,  H01L21/00 ,  H01L21/60 ,  H01L23/50

CPC classification number: H01L21/67144 ,  B26F1/14 ,  B26F2210/08 ,  Y10T83/8855

Abstract: A method and apparatus for aligning two mating tools is provided by a plurality of alignment members extending upward from the surface of one mating tool so that the alignment members engage in slidable contact with alignment tracks formed in the edges of the second mating tool. The alignment members and tracks can be formed in the four corners of rectangular mating tools, and the alignment members can be cylindrical rods with dome shaped tops. The alignment is useful both for tooling set-up as well as tooling usage. The alignment means can be used on a punch and lead form anvil for forming the outer leads of an integrated circuit bonded to a TAB tape.

Abstract translation: 用于对准两个配对工具的方法和装置由从一个配合工具的表面向上延伸的多个对准构件提供，使得对准构件与形成在第二配合工具的边缘中的对准轨道滑动接触。 对准构件和轨道可以形成在矩形配合工具的四个角中，并且对准构件可以是具有圆顶形顶部的圆柱形杆。 校准对于加工设置以及加工使用都很有用。 对准装置可用于冲头和导线砧上，用于形成结合到TAB带的集成电路的外引线。

公开(公告)号：US5135636A

公开(公告)日：1992-08-04

申请号：US762430

申请日：1991-09-19

Applicant: Ian Y. K. Yee ,  James D. Wehrly, Jr.

Inventor： Ian Y. K. Yee ,  James D. Wehrly, Jr.

IPC: C25D17/08

CPC classification number: C25D17/08 ,  Y10S204/07

Abstract: A plating rack for use in electroplating at least one substrate includes a rack body onto which the substrate may be placed; a metal ring connected to the rack body so as to surround a substrate placed on the rack body; and bistable, single-tipped cam assemblies for holding a placed substrate in place and for making electrical contact between the metal ring and the substrate.

Abstract translation: 用于电镀至少一个基板的电镀架包括可放置基板的支架体; 金属环，连接到所述齿条体，以围绕放置在所述齿条体上的基底; 以及用于将放置的基板保持在适当位置并且用于在金属环和基板之间进行电接触的双稳态单头凸轮组件。