PARALLEL COMPUTATION OF COMPUTATIONALLY EXPENSIVE PARAMETER CHANGES
    1.
    发明申请
    PARALLEL COMPUTATION OF COMPUTATIONALLY EXPENSIVE PARAMETER CHANGES 有权
    计算费用参数变化的并行计算

    公开(公告)号:US20100128061A1

    公开(公告)日:2010-05-27

    申请号:US12410265

    申请日:2009-03-24

    IPC分类号: G09G5/00

    摘要: One embodiment of the invention sets forth a graphics application configured to generate previews of a graphics object when a configurable parameter is modified. A computation engine computes the result of the modified parameter value and determines a set of additional parameter values based on configurable meta-data. The computation engine then computes results of each additional parameter value. Each computed result specifies a different change in the characteristic of the graphics object. The computation engine transmits the computed results to a preview generator, also included in the graphics application. For each computed result, the preview generator generates a preview of the graphics object that incorporates the change in the characteristic of the graphics object. The previews are transmitted to a preview pane for display. The user may then select one of the previews, and the parameter value of the configurable parameter is modified based on the selected preview.

    摘要翻译: 本发明的一个实施例阐述了一种图形应用,其被配置为当可配置参数被修改时生成图形对象的预览。 计算引擎计算修改参数值的结果,并根据可配置的元数据确定一组附加参数值。 然后,计算引擎计算每个附加参数值的结果。 每个计算结果指定图形对象的特性的不同变化。 计算引擎将计算结果发送到预览生成器,也包括在图形应用程序中。 对于每个计算结果,预览生成器生成包含图形对象特征变化的图形对象的预览。 预览将传送到预览窗格进行显示。 然后,用户可以选择预览之一,并且基于所选择的预览修改可配置参数的参数值。

    Hot wall rapid thermal processor
    2.
    发明授权
    Hot wall rapid thermal processor 失效
    热墙快速热处理器

    公开(公告)号:US06300600B1

    公开(公告)日:2001-10-09

    申请号:US09373894

    申请日:1999-08-12

    IPC分类号: F27B514

    摘要: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.

    摘要翻译: 公开了一种用于晶片热处理的设备。 该装置包括具有热源的加热室。 冷却室位于加热室附近并且包括冷却源。 晶片保持器构造成通过通道在冷却室和加热室之间移动,并且一个或多个快门限定通道的尺寸。 一个或多个百叶窗可以在晶片保持器可以穿过通道的打开位置和限定通道的阻塞位置之间移动,该通道小于当快门处于打开位置时所限定的通道。

    Parallel computation of computationally expensive parameter changes
    3.
    发明授权
    Parallel computation of computationally expensive parameter changes 有权
    计算昂贵的参数变化的并行计算

    公开(公告)号:US08248428B2

    公开(公告)日:2012-08-21

    申请号:US12410265

    申请日:2009-03-24

    IPC分类号: G09G5/00

    摘要: One embodiment of the invention sets forth a graphics application configured to generate previews of a graphics object when a configurable parameter is modified. A computation engine computes the result of the modified parameter value and determines a set of additional parameter values based on configurable meta-data. The computation engine then computes results of each additional parameter value. Each computed result specifies a different change in the characteristic of the graphics object. The computation engine transmits the computed results to a preview generator, also included in the graphics application. For each computed result, the preview generator generates a preview of the graphics object that incorporates the change in the characteristic of the graphics object. The previews are transmitted to a preview pane for display. The user may then select one of the previews, and the parameter value of the configurable parameter is modified based on the selected preview.

    摘要翻译: 本发明的一个实施例阐述了一种图形应用,其被配置为当可配置参数被修改时生成图形对象的预览。 计算引擎计算修改参数值的结果,并根据可配置的元数据确定一组附加参数值。 然后,计算引擎计算每个附加参数值的结果。 每个计算结果指定图形对象的特性的不同变化。 计算引擎将计算结果发送到预览生成器,也包括在图形应用程序中。 对于每个计算结果,预览生成器生成包含图形对象特征变化的图形对象的预览。 预览将传送到预览窗格进行显示。 然后,用户可以选择预览之一,并且基于所选择的预览修改可配置参数的参数值。

    Hot wall rapid thermal processor
    4.
    发明授权
    Hot wall rapid thermal processor 失效
    热墙快速热处理器

    公开(公告)号:US06492621B2

    公开(公告)日:2002-12-10

    申请号:US09934952

    申请日:2001-08-21

    IPC分类号: F27B514

    摘要: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.

    摘要翻译: 公开了一种用于晶片热处理的设备。 该装置包括具有热源的加热室。 冷却室位于加热室附近并且包括冷却源。 晶片保持器构造成通过通道在冷却室和加热室之间移动,并且一个或多个快门限定通道的尺寸。 一个或多个百叶窗可以在晶片保持器可以穿过通道的打开位置和限定通道的阻塞位置之间移动,该通道小于当快门处于打开位置时限定的通道。