公开(公告)号：US08567256B2

公开(公告)日：2013-10-29

申请号：US13819450

申请日：2011-08-29

Applicant: Ulrich Albicker ,  Christof Sonderegger ,  Peter Meister ,  Jochen Von Berg ,  Rene Tanner ,  Jeffrey M. Schnellinger

Inventor： Ulrich Albicker ,  Christof Sonderegger ,  Peter Meister ,  Jochen Von Berg ,  Rene Tanner ,  Jeffrey M. Schnellinger

IPC: G01L9/06

CPC classification number: G01L9/06 ,  G01L19/0038 ,  G01L19/0046 ,  G01L19/147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A piezoresistive sensor chip element of a pressure sensor has lower face with an outer edge, an adhesion area and a non-adhesion area. The chip has a closed chip cavity for measuring the pressure of a medium flowing around the chip. The upper face of a substrate is fastened only at the adhesion area of the chip. The non-adhesion area extends at least over a circular area arranged centrally on the lower face and covers a third of the lower face's total area and extends over at least one connection area from the circular area to the edge of the lower face. The pressure in the pressure medium can spread through the connection area into a space under the non-adhesion area on the element lower face. The substrate has a recess located centrally under the sensor chip element.

Abstract translation: 压力传感器的压阻传感器芯片元件具有具有外边缘，粘附区域和非粘附区域的下表面。 该芯片具有封闭的芯片空腔，用于测量流过芯片的介质的压力。 基板的上表面仅紧固在芯片的粘附区域。 非粘附区域至少在布置在下表面中心的圆形区域上延伸并且覆盖下表面总面积的三分之一并且在从圆形区域到下表面的边缘的至少一个连接区域上延伸。 压力介质中的压力可通过连接区域扩散到元件下表面上的非粘附区域下方的空间。 衬底具有位于传感器芯片元件下方中心的凹部。

公开(公告)号：US06279395B1

公开(公告)日：2001-08-28

申请号：US09418256

申请日：1999-10-15

Applicant: Michael D. Insalaco ,  Jeffrey M. Schnellinger ,  Andrew Crawford

Inventor： Michael D. Insalaco ,  Jeffrey M. Schnellinger ,  Andrew Crawford

IPC: G01F1509

CPC classification number: G01P15/0907 ,  G01L1/16 ,  G01L9/08 ,  G01L23/10 ,  G01P15/0915

Abstract: A sensor including a center post extending along the sensing axis of the sensor, a piezoelectric sensing element concentrically engaging the center post, and a preload element preloading the piezoelectric element radially outward to the axis. The center post includes a recess along the axis and the first preload element is in the recess and preloads the piezoelectric element radially outward. The sensor may include a mass concentrically engaging the piezoelectric element. The sensor senses acceleration, force or pressure.

Abstract translation: 包括沿着传感器的感测轴延伸的中心柱的传感器，与中心柱同心接合的压电感测元件以及预先将压电元件径向向外加载到轴线的预载元件。 中心柱包括沿着轴的凹部，并且第一预加载元件在凹部中并且将压电元件径向向外预加载。 传感器可以包括与压电元件同心接合的质量。 传感器感应加速度，力或压力。

公开(公告)号：US20130167650A1

公开(公告)日：2013-07-04

申请号：US13819450

申请日：2011-08-29

Applicant: Ulrich Albicker ,  Christof Sonderegger ,  Peter Meister ,  Jochen Von Berg ,  Rene Tanner ,  Jeffrey M. Schnellinger

Inventor： Ulrich Albicker ,  Christof Sonderegger ,  Peter Meister ,  Jochen Von Berg ,  Rene Tanner ,  Jeffrey M. Schnellinger

IPC: G01L9/06

CPC classification number: G01L9/06 ,  G01L19/0038 ,  G01L19/0046 ,  G01L19/147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A piezoresistive sensor chip element of a pressure sensor has lower face with an outer edge, an adhesion area and a non-adhesion area. The chip has a closed chip cavity for measuring the pressure of a medium flowing around the chip. The upper face of a substrate is fastened only at the adhesion area of the chip. The non-adhesion area extends at least over a circular area arranged centrally on the lower face and covers a third of the lower face's total area and extends over at least one connection area from the circular area to the edge of the lower face. The pressure in the pressure medium can spread through the connection area into a space under the non-adhesion area on the element lower face. The substrate has a recess located centrally under the sensor chip element.

Abstract translation: 压力传感器的压阻传感器芯片元件具有具有外边缘，粘附区域和非粘附区域的下表面。 该芯片具有封闭的芯片空腔，用于测量流过芯片的介质的压力。 基板的上表面仅紧固在芯片的粘附区域。 非粘附区域至少在布置在下表面中心的圆形区域上延伸并且覆盖下表面总面积的三分之一并且在从圆形区域到下表面的边缘的至少一个连接区域上延伸。 压力介质中的压力可通过连接区域扩散到元件下表面上的非粘附区域下方的空间。 衬底具有位于传感器芯片元件下方中心的凹部。