公开(公告)号：US20070008105A1

公开(公告)日：2007-01-11

申请号：US11147973

申请日：2005-06-08

Applicant: Kevin Verrier ,  David Bernhardt ,  Jerry Negrotti ,  Donald Polner

Inventor： Kevin Verrier ,  David Bernhardt ,  Jerry Negrotti ,  Donald Polner

IPC: G08B19/00

CPC classification number: H01L21/67259 ,  H01L21/68

Abstract: Method and apparatus for use in setting up workpiece treatment or processing equipment. A disclosed system processes silicon wafers that are treated during processing steps in producing semiconductor integrated circuits. The processing equipment includes a wafer support that supports a wafer in a treatment region during wafer processing. A housing provides a controlled environment within the housing interior for processing the wafer on the wafer support. A mechanical transfer system transports wafers to and from the support. A wafer simulator is used to simulate wafer movement and includes a pressure sensor for monitoring contact between the simulator and the wafer transfer and support equipment. In one illustrated embodiment the wafer simulator is generally circular and includes three equally spaced pressure sensors for monitoring contact with wafer transport and support equipment.

Abstract translation: 用于设置工件处理或加工设备的方法和装置。 所公开的系统处理在制造半导体集成电路的处理步骤期间处理的硅晶片。 处理设备包括在晶片处理期间在处理区域中支撑晶片的晶片支撑件。 壳体在壳体内部提供受控的环境，用于在晶片支撑件上处理晶片。 机械传输系统将晶片传送到支撑件和从支撑件传送晶片。 使用晶片模拟器来模拟晶片移动，并且包括用于监测模拟器与晶片转移和支撑设备之间的接触的压力传感器。 在一个所示实施例中，晶片模拟器通常是圆形的并且包括三个等间隔的压力传感器，用于监测与晶片输送和支撑设备的接触。