Multi-gate semiconductor devices
    1.
    发明授权
    Multi-gate semiconductor devices 有权
    多栅极半导体器件

    公开(公告)号:US08227861B2

    公开(公告)日:2012-07-24

    申请号:US12975808

    申请日:2010-12-22

    IPC分类号: H01L21/70

    摘要: A semiconductor device includes a substrate, a source region formed over the substrate, a drain region formed over the substrate, a first gate electrode over the substrate adjacent to the source region and between the source and drain regions, and a second gate electrode over the substrate adjacent to the drain region and between the source and drain regions.

    摘要翻译: 半导体器件包括衬底,形成在衬底上的源极区域,形成在衬底上的漏极区域,与衬底相邻的源极区域和源极区域与漏极区域之间的第一栅电极,以及位于源极区域和漏极区域之间的第二栅电极, 衬底,其与漏极区域相邻并且在源极和漏极区域之间。

    High gain tunable bipolar transistor
    2.
    发明授权
    High gain tunable bipolar transistor 有权
    高增益可调双极晶体管

    公开(公告)号:US08212292B2

    公开(公告)日:2012-07-03

    申请号:US12622625

    申请日:2009-11-20

    IPC分类号: H01L31/0328

    摘要: An improved bipolar transistor (40, 40′) is provided, manufacturable by a CMOS IC process without added steps. The improved transistor (40, 40′) comprises an emitter (48) having first (482) and second (484) portions of different depths (4821, 4841), a base (46) underlying the emitter (48) having a central portion (462) of a first base width (4623) underlying the first portion (482) of the emitter (48), a peripheral portion (464) having a second base width (4643) larger than the first base width (4623) partly underlying the second portion (484) of the emitter (48), and a transition zone (466) of a third base width (4644) and lateral extent (4661) lying laterally between the first (462) and second (464) portions of the base (46), and a collector (44) underlying the base (46). The gain of the transistor (40, 40′) is much larger than a conventional bipolar transistor (20) made using the same CMOS process. By adjusting the lateral extent (4661) of the transition zone (466), the properties of the improved transistor (40, 40′) can be tailored to suit different applications without modifying the underlying CMOS IC process.

    摘要翻译: 提供改进的双极晶体管(40,40'),可通过CMOS IC工艺制造而无需附加步骤。 改进的晶体管(40,40')包括具有不同深度(4821,4481)的第一(482)和第二(484)部分的发射器(48),位于发射器(48)下方的基座(46)具有中心部分 (462)位于发射器(48)的第一部分(482)下方的第一基底宽度(4623)的外围部分(462),具有大于第一基部宽度(4623)的第二基底宽度(4643)的周边部分(464) 发射器(48)的第二部分(484)和位于第一(462)和第二(464)部分之间的侧向位于第三基部宽度(4644)和横向范围(4661)的过渡区(466) 基部(46)和底部(46)下方的收集器(44)。 晶体管(40,40')的增益比使用相同CMOS工艺制造的传统双极晶体管(20)大得多。 通过调整过渡区域(466)的横向范围(4661),改进的晶体管(40,40')的特性可以被调整以适应不同的应用而不修改底层的CMOS IC工艺。