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公开(公告)号：US07364496B2
公开(公告)日：2008-04-29
申请号：US11680588
申请日：2007-02-28
IPC分类号： B24B7/22
CPC分类号： B24B37/30
摘要： A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.
摘要翻译： 用于处理和抛光半导体晶片的抛光头和方法使用具有至少一个凹陷区域和外部柔性膜的基底结构，所述至少一个凹陷区域和外部柔性膜可以符合至少一个凹部区域以形成至少一个凹陷部，以将半导体晶片保持在外部 当对至少一个凹陷施加抽吸时的柔性膜。
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公开(公告)号：US20080014842A1
公开(公告)日：2008-01-17
申请号：US11774532
申请日：2007-07-06
申请人： David Berkstresser , Jerry Berkstresser , Jino Park , Hanjoo Lee , In-Kwon Jeong
发明人： David Berkstresser , Jerry Berkstresser , Jino Park , Hanjoo Lee , In-Kwon Jeong
IPC分类号： B24B29/02
CPC分类号： B24B37/30
摘要： A polishing head and method for chucking a semiconductor wafer onto the polishing head uses a base structure and an outer flexible membrane with at least a first annular chamber and a second annular chamber positioned between the base structure and the outer flexible membrane. The polishing head includes a central cavity positioned below the base structure and at least partly defined by the outer flexible membrane, which is used to hold the semiconductor wafer onto the outer flexible membrane.
摘要翻译： 用于将半导体晶片夹持到抛光头上的抛光头和方法使用基部结构和外部柔性膜，至少第一环形室和位于基部结构和外部柔性膜之间的第二环形室。 抛光头包括位于基部结构下方并且至少部分地由外柔性膜限定的中心腔，该外柔性膜用于将半导体晶片保持在外柔性膜上。
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公开(公告)号：US06752599B2
公开(公告)日：2004-06-22
申请号：US09879791
申请日：2001-06-11
申请人： Jino Park
发明人： Jino Park
IPC分类号： F04B45053
CPC分类号： F04B43/06 , F04B49/065
摘要： A controller for a photoresist dispense pump is described that actively monitors the operation of the pump and dynamically determines completion of the refill of the pump. In one embodiment, pressure measurements are made during the refill step. Changes in the pressure measurements are used to indicate completion of the refill. After refill is completed, the refill step is terminated and the operation cycle is continued.
摘要翻译： 描述了用于光致抗蚀剂分配泵的控制器，其主动地监视泵的操作并且动态地确定泵的再填充的完成。 在一个实施例中，在再填充步骤期间进行压力测量。 压力测量值的变化用于指示补充物的完成。 在再填充完成之后，再填充步骤终止并且继续操作循环。
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公开(公告)号：US20070207709A1
公开(公告)日：2007-09-06
申请号：US11680588
申请日：2007-02-28
IPC分类号： B24B7/30
CPC分类号： B24B37/30
摘要： A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.
摘要翻译： 用于处理和抛光半导体晶片的抛光头和方法使用具有至少一个凹陷区域和外部柔性膜的基底结构，所述至少一个凹陷区域和外部柔性膜可以符合至少一个凹部区域以形成至少一个凹陷部，以将半导体晶片保持在外部 当对至少一个凹陷施加抽吸时的柔性膜。
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