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公开(公告)号：US20110313697A1
公开(公告)日：2011-12-22
申请号：US13107923
申请日：2011-05-15
CPC分类号： G01R31/3679 , G01R31/3651
摘要： A method and apparatus for monitoring battery life in a human input device powered by replaceable batteries includes repeatedly measuring battery charge by use of a measuring arrangement forming part of the input device. Battery charge is measured while the input device is in a relatively inactive condition and when it is in an active condition, and a time value is associated with each battery charge measurement. A usage model may be constructed based on the battery charge measurements, and calculation of an expected battery life may be based at least in part on the usage model.
摘要翻译： 用于监视由可更换电池供电的人体输入装置中的电池寿命的方法和装置包括通过使用形成输入装置的一部分的测量装置重复测量电池电量。 当输入设备处于相对不活动状态并且处于活动状态时测量电池电量，并且时间值与每个电池电量测量相关联。 可以基于电池电量测量构建使用模型，并且可以至少部分地基于使用模型来计算期望的电池寿命。
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公开(公告)号：US08990038B2
公开(公告)日：2015-03-24
申请号：US13107923
申请日：2011-05-15
CPC分类号： G01R31/3679 , G01R31/3651
摘要： A method and apparatus for monitoring battery life in a human input device powered by replaceable batteries includes repeatedly measuring battery charge by use of a measuring arrangement forming part of the input device. Battery charge is measured while the input device is in a relatively inactive condition and when it is in an active condition, and a time value is associated with each battery charge measurement. A usage model may be constructed based on the battery charge measurements, and calculation of an expected battery life may be based at least in part on the usage model.
摘要翻译： 用于监视由可更换电池供电的人体输入装置中的电池寿命的方法和装置包括通过使用形成输入装置的一部分的测量装置重复测量电池电量。 当输入设备处于相对不活动状态并且处于活动状态时测量电池电量，并且时间值与每个电池电量测量相关联。 可以基于电池电量测量构建使用模型，并且可以至少部分地基于使用模型来计算期望的电池寿命。
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公开(公告)号：US08989792B1
公开(公告)日：2015-03-24
申请号：US12823074
申请日：2010-06-24
申请人： John Depew
发明人： John Depew
IPC分类号： H04B17/00
CPC分类号： H04B1/3838 , H01Q1/243 , H01Q21/28 , H04W52/146 , H04W52/283 , H04W52/367
摘要： A user device obtains motion data from an inertial sensor included in the user device. The user device receives a command to transmit information at a specified transmit power level. The user device determines, based on the motion data, whether the presence of a human body part is detected. When the presence of a human body part is detected, the user device reduces a current transmit power level below the specified transmit power level.
摘要翻译： 用户设备从包括在用户设备中的惯性传感器获取运动数据。 用户设备接收以指定的发射功率电平发送信息的命令。 用户装置基于运动数据确定是否检测到人体部位的存在。 当检测到人体部位的存在时，用户装置将当前发射功率电平降低到低于指定的发射功率电平。
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公开(公告)号：US08934937B1
公开(公告)日：2015-01-13
申请号：US12748738
申请日：2010-03-29
申请人： Gregg Zehr , Subram Narasimhan , Varadarajan Gopalakrishnan , David C. Buuck , John Depew , In Chul Hyun
发明人： Gregg Zehr , Subram Narasimhan , Varadarajan Gopalakrishnan , David C. Buuck , John Depew , In Chul Hyun
IPC分类号： H04B17/00
CPC分类号： H04W52/18 , H01Q1/243 , H01Q1/245 , H01Q21/28 , H04B1/3838 , H04W52/228 , H04W52/36 , H04W52/367
摘要： A user device transmits data at a first transmit power level. The user device detects a presence of a human body part within a predetermined distance from an antenna of the user device using one or more sensors disposed at a back side of the user device. In response to the detection of the presence of the human body part, the user device transmits information at a second transmit power level that is less than the first transmit power level.
摘要翻译： 用户设备以第一发射功率电平发送数据。 用户装置使用设置在用户装置的背面的一个或多个传感器来检测来自用户装置的天线的预定距离内的人体部位的存在。 响应于检测到人体部分的存在，用户装置以小于第一发射功率电平的第二发射功率电平发射信息。
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公开(公告)号：US20070195506A1
公开(公告)日：2007-08-23
申请号：US11786101
申请日：2007-04-10
申请人： John Depew
发明人： John Depew
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/16195
摘要： An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip and in contact with an external device to dissipate heat generated by the integrated circuit chip. The electronic assembly further comprises a standoff structure disposed adjacent the thermal-gap-filler pad and coupled to the support board, the standoff structure configured to prevent excessive force from being applied onto the thermal-gap-filler.
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公开(公告)号：US20060056158A1
公开(公告)日：2006-03-16
申请号：US11269961
申请日：2005-11-08
申请人： John Depew
发明人： John Depew
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/16195
摘要： An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip and in contact with an external device to dissipate heat generated by the integrated circuit chip. The electronic assembly further comprises a standoff structure disposed adjacent the thermal-gap-filler pad and coupled to the support board, the standoff structure configured to prevent excessive force from being applied onto the thermal-gap-filler.
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