公开(公告)号：US06427566B1

公开(公告)日：2002-08-06

申请号：US09540160

申请日：2000-03-31

申请人： Oliver David Jones ,  John G. Dewit

发明人： Oliver David Jones ,  John G. Dewit

IPC分类号： B08B104

CPC分类号： H01L21/67046 ,  Y10T82/16967 ,  Y10T82/2571 ,  Y10T82/266

摘要： A self-aligning mandrel assembly is provided. The assembly includes a cylindrical inner core and a fulcrum disposed on an outer surface of the cylindrical inner core. A mandrel shell surrounds the cylindrical inner core. The mandrel shell has a wafer preparation material affixed to an outer surface thereof, and the mandrel shell is pivotably supported by the fulcrum such that the mandrel shell aligns with a surface of a substrate when the wafer preparation material contacts the surface of the substrate.

摘要翻译： 提供自对准心轴组件。 该组件包括一个圆柱形内芯和一个设置在圆柱形内芯的外表面上的支点。 心轴壳围绕圆柱形内芯。 心轴壳体具有固定在其外表面上的晶片制备材料，并且心轴壳体由支点枢转地支撑，使得当晶片制备材料接触衬底的表面时，心轴壳体与衬底的表面对准。

公开(公告)号：US06368192B1

公开(公告)日：2002-04-09

申请号：US09540975

申请日：2000-03-31

申请人： Oliver David Jones ,  David T. Frost ,  John G. Dewit

发明人： Oliver David Jones ,  David T. Frost ,  John G. Dewit

IPC分类号： B24B700

CPC分类号： H01L21/67046

摘要： An apparatus for preparing a semiconductor wafer is provided. The apparatus includes a wafer drive assembly having a pair of wafer drive rollers for rotating a semiconductor wafer in a vertical orientation. The wafer drive assembly is configured such that the wafer drive rollers are controllably movable from a first position to a second position. Also provided as part of the apparatus is a pair of wafer preparation assemblies movably disposed in an opposing relationship above the wafer drive assembly. Each of the wafer preparation assemblies has a first wafer preparation member and a second wafer preparation member. The wafer preparation assemblies being movable into a first position in which each of the first wafer preparation members is position to perform a first wafer preparation operation on the wafer and into a second position in which each of the second wafer preparation members is positioned to perform a second wafer preparation operation on the wafer.

摘要翻译： 提供了一种用于制备半导体晶片的装置。 该装置包括具有一对晶片驱动辊的晶片驱动组件，用于在垂直方向上旋转半导体晶片。 晶片驱动组件被构造成使得晶片驱动辊可控地从第一位置移动到第二位置。 还提供作为设备的一部分的一对晶片制备组件可移动地设置在晶片驱动组件上方的相对关系中。 每个晶片制备组件具有第一晶片准备部件和第二晶片准备部件。 所述晶片准备组件可移动到第一位置，在所述第一位置中，所述第一晶片准备构件中的每一个位置以在所述晶片上执行第一晶片准备操作并进入第二位置，其中每个所述第二晶片准备构件被定位成执行 在晶片上进行第二晶片制备操作。

公开(公告)号：US06328640B1

公开(公告)日：2001-12-11

申请号：US09540097

申请日：2000-03-31

申请人： Oliver David Jones ,  John G. Dewit

发明人： Oliver David Jones ,  John G. Dewit

IPC分类号： B24B700

CPC分类号： H01L21/67046

摘要： An apparatus for preparing a semiconductor wafer is provided. The apparatus includes a pair of drive rollers disposed so as to support a semiconductor wafer in a substantially vertical orientation. Each of the drive rollers is configured to be coupled to a drive belt for rotating the drive rollers. The apparatus further includes a pair of wafer preparation assemblies that is movably disposed in an opposing relationship. Each of the wafer preparation assemblies have a first wafer preparation member and a second wafer preparation member. The wafer preparation assemblies being movable into a first position in which each of the first wafer preparation members is positioned to perform a first wafer preparation operation on the wafer and into a second position in which each of the second wafer preparation members is positioned to perform a second wafer preparation operation on the wafer.

摘要翻译： 提供了一种用于制备半导体晶片的装置。 该装置包括一对驱动辊，其设置成以基本上垂直的方向支撑半导体晶片。 每个驱动辊构造成联接到用于旋转驱动辊的驱动带。 该装置还包括一对可移动地以相对关系设置的晶片制备组件。 每个晶片制备组件具有第一晶片准备部件和第二晶片准备部件。 晶片准备组件可移动到第一位置，其中每个第一晶片准备构件定位成在晶片上执行第一晶片准备操作并进入第二位置，其中每个第二晶片准备构件定位成执行 在晶片上进行第二晶片制备操作。