Dielectric mixture composition sensor with compensation for mixture
electrical conductivity
    1.
    发明授权
    Dielectric mixture composition sensor with compensation for mixture electrical conductivity 失效
    介质混合物组成传感器,补偿混合导电性

    公开(公告)号:US6057693A

    公开(公告)日:2000-05-02

    申请号:US703498

    申请日:1996-08-27

    IPC分类号: G01N27/22 G01N33/28 G01N33/22

    CPC分类号: G01N33/2852 G01N27/221

    摘要: The composition of an electrically conductive mixture, such as a mixture of gasoline and alcohol, is measured using a single measurement cell having a first electrode and a second electrode with a measurement space therebetween for receiving a specimen of the mixture. With a specimen of the mixture in the measurement space, the first electrode is alternatively connected to a reference discharge voltage, preferably ground, and to an applied voltage through a resistor. A first operational state encompasses the period when the first electrode is connected to the reference discharge voltage and a second operational state encompasses the period when the first electrode is connected to the applied voltage through the resistor. A first operational state peak voltage is measured during the first operational state, and a second operational state peak voltage is measured during the second operational state. The first operational state peak voltage and a preselected constant proper fraction of the second operational state peak voltage are summed to obtain a summed voltage output, which may be correlated to the composition of the mixture.

    摘要翻译: 使用具有第一电极和第二电极的单个测量单元测量诸如汽油和醇的混合物的导电混合物的组成,其间具有用于接收混合物样品的测量空间。 在测量空间中的混合物样本中,第一电极交替地连接到参考放电电压,优选接地,并通过电阻器连接到施加的电压。 第一操作状态包括第一电极连接到参考放电电压的时段,第二操作状态包括通过电阻器将第一电极连接到施加的电压的周期。 在第一操作状态期间测量第一操作状态峰值电压,并且在第二操作状态期间测量第二操作状态峰值电压。 第一操作状态峰值电压和第二操作状态峰值电压的预选常数适当分数被相加以获得可以与混合物的组成相关的总和电压输出。

    Dielectric mixture composition linear sensor with compensation for
mixture electrical conductivity
    2.
    发明授权
    Dielectric mixture composition linear sensor with compensation for mixture electrical conductivity 失效
    介质混合物组成线性传感器补偿混合导电性

    公开(公告)号:US5717339A

    公开(公告)日:1998-02-10

    申请号:US703159

    申请日:1996-08-28

    IPC分类号: G01N27/22 G01N33/28 G01R27/26

    CPC分类号: G01N27/221 G01N33/2852

    摘要: The composition of an electrically conductive mixture, preferably a mixture of gasoline and alcohol, is measured using a single measurement cell having a first electrode and a second electrode with a measurement space therebetween for receiving a specimen of the mixture. With a specimen of the mixture in the measurement space, the first electrode is alternatively connected to a reference discharge voltage, preferably ground, and to a feedback control voltage. A first operational state encompasses the period when the first electrode is connected to the reference discharge voltage and a second operational state encompasses the period when the first electrode is connected to the feedback control voltage. A first operational state peak voltage is measured during the first operational state, and a peak second operational state voltage is measured during the second operational state. The first operational state voltage and a preselected constant proper fraction of the peak second operational state voltage are mathematically combined to obtain a voltage output, which may be correlated to the composition of the mixture. The voltage output is also used as the feedback control voltage, to produce a linear signal output as a function of dielectric constant of the conductive mixture.

    摘要翻译: 使用具有第一电极和第二电极的单个测量单元测量导电混合物,优选汽油和醇的混合物的组成,其间具有用于接收混合物样品的测量空间。 在测量空间中混合物的样本,第一电极交替地连接到参考放电电压,优选接地,并且连接到反馈控制电压。 第一操作状态包括第一电极连接到参考放电电压的时段,第二操作状态包括第一电极连接到反馈控制电压的周期。 在第一操作状态期间测量第一操作状态峰值电压,并且在第二操作状态期间测量峰值第二操作状态电压。 峰值第二操作状态电压的第一操作状态电压和预选的恒定适当分数在数学上被组合以获得电压输出,其可以与混合物的组成相关。 电压输出也用作反馈控制电压,以产生作为导电混合物的介电常数的函数的线性信号输出。

    Stacked high density interconnected integrated circuit system
    3.
    发明授权
    Stacked high density interconnected integrated circuit system 失效
    堆叠高密度互连集成电路系统

    公开(公告)号:US5481134A

    公开(公告)日:1996-01-02

    申请号:US237701

    申请日:1994-05-03

    IPC分类号: H01L25/10 H01L23/02

    摘要: A three dimensional stacked integrated circuit system. The system includes a motherboard, a plurality of stacked integrated circuit subassemblies, and a plurality of Z-flex circuits coupled therebetween. The plurality of stacked integrated circuit subassemblies each comprise a base, an integrated circuit, and an X-Y flexprint circuit folded around the edges of the base that provides conducting paths thereto. The base comprises a heat conducting material, such as aluminum, aluminum nitride, alumina, beryllium oxide, or copper, for example. The X-Y flexprint circuits comprise printed interconnects that provide conducting paths between the motherboard and the integrated circuit subassemblies. The Z-flex printed circuits comprise a plurality of bumps that mate with a plurality of rings of the X-Y flexprint circuits, and a plurality of wrinkles that accommodate tolerance build up between the integrated circuit subassemblies. The Z-flex printed circuits may be single layer or multilayer flex circuits, or may comprise a lateral Z-flex printed circuit. The present invention thus interconnects several integrated circuits together to provide for a very high density, low weight, repairable microelectronic integrated circuit package. The system utilizes flexprint, bump, ring, and wire bonding (beam lead or tab) technologies that have been proven and tested for commercial and military applications. The system provides for a high density integrated circuit package that implements a thermal management scheme to maximize heat transfer away from the integrated circuits.

    摘要翻译: 三维堆叠集成电路系统。 该系统包括主板,多个堆叠的集成电路子组件和耦合在它们之间的多个Z-flex电路。 多个堆叠的集成电路子组件各自包括基座,集成电路和围绕提供到其的导电路径的基座的边缘折叠的X-Y柔性印刷电路。 基底例如包括导热材料,例如铝,氮化铝,氧化铝,氧化铍或铜。 X-Y柔性印刷电路包括在主板和集成电路子组件之间提供导电路径的印刷互连。 Z-flex印刷电路包括与X-Y柔性印刷电路的多个环相配合的多个凸起,以及适应集成电路子组件之间的公差的多个皱纹。 Z-柔性印刷电路可以是单层或多层柔性电路,或者可以包括侧向Z形柔性印刷电路。 因此,本发明将几个集成电路互连在一起,以提供非常高密度,低重量的可修复的微电子集成电路封装。 该系统采用已被证明和测试用于商业和军事应用的柔印,凸块,环形和引线键合(光束引线或标签)技术。 该系统提供了一种实现热管理方案的高密度集成电路封装,以最大限度地发挥远离集成电路的热传递。