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公开(公告)号：US20080007255A1
公开(公告)日：2008-01-10
申请号：US11483481
申请日：2006-07-10
申请人： Stewart D. Johnson , EuGene D. Alfors , Lawrence E. Franzee , Joseph K. Murdock , Jason M. Chilcote , John S. Patin
发明人： Stewart D. Johnson , EuGene D. Alfors , Lawrence E. Franzee , Joseph K. Murdock , Jason M. Chilcote , John S. Patin
IPC分类号： G01B7/14
摘要： Multiple magnetic sensing transducers can detect the position of a target. For example, a linear array of transducers can detect a target's linear position. A master and slave arrangement can reduce the cost and size of a system containing multiple magnetic sensing transducers. The master contains circuitry for voltage regulation and processing logic as well as a magnetic sensing transducer. The slaves contain a magnetic sensing transducer and little else. As such, the slave units are small and inexpensive. The slaves obtain power from the master, produce detection signals, and pass the detection signals to the master. The master interprets the detection signals along with an internal detection produced by the master's internal magnetic sensing transducer to produce a position signal.
摘要翻译： 多个磁感应传感器可以检测目标的位置。 例如，换能器的线性阵列可以检测目标的线性位置。 主从配置可以降低包含多个磁传感器的系统的成本和尺寸。 主器件包含用于电压调节和处理逻辑的电路以及磁传感器。 从站包含一个磁传感器，另外一些。 因此，从属单元是小而便宜的。 从站从主站获取电源，产生检测信号，并将检测信号传递给主站。 主机将检测信号与主机内部磁感应传感器产生的内部检测一起解释，产生位置信号。
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公开(公告)号：US07378721B2
公开(公告)日：2008-05-27
申请号：US11295371
申请日：2005-12-05
IPC分类号： H01L23/495 , G01P3/42
CPC分类号： H01L23/49575 , G01D11/245 , H01L2224/48091 , H01L2224/49171 , H01L2924/00014
摘要： A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.
摘要翻译： 传感器封装装置包括支撑一个或多个电气部件的引线框架基板，其连接到并位于引线框架基板上。 还提供了多个引线键合，其将电气部件电连接到引线框架基板，其中引线框架基板由热固性塑料封装以保护多个引线接合和至少一个电气部件，从而提供传感器 包括引线框架基板，电气部件和引线接合的封装装置，同时不需要印刷电路板（PCB）或陶瓷基板代替引线框架基板作为传感器封装的一部分 仪器。 还可以提供导电环氧树脂以保持电气部件与引线框架基板的连接。 电气部件可以构成例如IC芯片和/或感测元件（例如，磁阻部件）或感测芯片。
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公开(公告)号：US07245122B2
公开(公告)日：2007-07-17
申请号：US11315924
申请日：2005-12-21
CPC分类号： G01D5/147 , F16H59/105
摘要： A vane actuated drive mode sensor is generally composed of two primary components, including a drive mode sensor array and an actuator. The sensor array can be provided as a housing composed of a plurality of Hall Effect (HE) sensors, magnets and the electronics associated with the sensors. The actuator, also referred to as a vane, can be provided as a plate constructed from a magnetic material, such as, for example, ferrous steel, and can be provided with holes punched thereon at different places depending on the requirement of a user. The actuator can be connected to a user's driver and can slide on and/or within the housing.
摘要翻译： 叶片致动驱动模式传感器通常由两个主要部件组成，包括驱动模式传感器阵列和致动器。 传感器阵列可以设置为由多个霍尔效应（HE）传感器，磁体和与传感器相关联的电子装置组成的壳体。 致动器（也称为叶片）可以设置为由诸如黑色金属的磁性材料构成的板，并且可以根据使用者的要求在不同的位置设置有冲孔的孔。 致动器可以连接到用户的驾驶员，并且可以在壳体上和/或内部滑动。
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