公开(公告)号：US20110188679A1

公开(公告)日：2011-08-04

申请号：US13019364

申请日：2011-02-02

申请人： Gyeong-tae LEE ,  Jong-bae KIM ,  Jong-in JO

发明人： Gyeong-tae LEE ,  Jong-bae KIM ,  Jong-in JO

IPC分类号： H04R1/00

CPC分类号： H04R5/02 ,  H04R1/028 ,  H04R1/26 ,  H04R1/2811 ,  H04R3/04 ,  H04R5/04 ,  H04R2430/03 ,  H04R2499/15

摘要： An electronic device includes a sound plate switchable between a stand type and a hang type. In the electronic device, the sound plate has a coupled structure movable between a first arrangement, in which the sound plate functions as a stand and a second arrangement wherein the sound plate is disposed at the rear of a main body as a hang type. In the first arrangement, the sound plate emits a sound through a slit provided in a side surface of the sound plate, and in the second arrangement, the sound plate emits sound through an opening in a front surface of the sound plate which is perpendicular to the side surface of the sound plate.

摘要翻译： 电子设备包括可在支架型和挂式之间切换的声板。 在电子装置中，声板具有可在第一装置和第二装置之间移动的耦合结构，其中声板用作支架，而第二布置，其中声板布置在主体的后部作为悬挂式。 在第一布置中，声板通过设置在声板的侧表面中的狭缝发出声音，并且在第二布置中，声板通过声板的前表面中的开口发出声音，该开口垂直于 声板的侧面。

公开(公告)号：US08494186B2

公开(公告)日：2013-07-23

申请号：US13016019

申请日：2011-01-28

申请人： Gyeong-tae Lee ,  Jong-bae Kim ,  Jong-in Jo

发明人： Gyeong-tae Lee ,  Jong-bae Kim ,  Jong-in Jo

IPC分类号： H04R25/00

CPC分类号： H04R1/26 ,  H04R1/028 ,  H04R3/04 ,  H04R2499/15

摘要： Provided are a sound plate and an electronic device employing the same. The sound plate includes at least one speaker unit disposed within a plate that is configured as a stand of the electronic device. Sound output by the at least one speaker is emitted through at least slit provided in a side surface of the plate.

摘要翻译： 提供了一种声板和采用该声音板的电子装置。 声板包括设置在板内的至少一个扬声器单元，该扬声器单元配置为电子设备的支架。 由至少一个扬声器的声音输出通过设置在板的侧表面中的至少一个狭缝发射。

公开(公告)号：US20110188678A1

公开(公告)日：2011-08-04

申请号：US13016019

申请日：2011-01-28

申请人： Gyeong-tae LEE ,  Jong-bae KIM ,  Jong-in JO

发明人： Gyeong-tae LEE ,  Jong-bae KIM ,  Jong-in JO

IPC分类号： H04R1/00

CPC分类号： H04R1/26 ,  H04R1/028 ,  H04R3/04 ,  H04R2499/15

摘要： Provided are a sound plate and an electronic device employing the same. The sound plate includes at least one speaker unit disposed within a plate that is configured as a stand of the electronic device. Sound output by the at least one speaker is emitted through at least slit provided in a side surface of the plate.

摘要翻译： 提供了一种声板和采用该声音板的电子装置。 声板包括设置在板内的至少一个扬声器单元，该扬声器单元配置为电子设备的支架。 由至少一个扬声器的声音输出通过设置在板的侧表面中的至少一个狭缝发射。

公开(公告)号：US07388746B2

公开(公告)日：2008-06-17

申请号：US11519072

申请日：2006-09-12

申请人： Hee-sung Park ,  Jae-young Chang ,  Jong-in Jo ,  Han-kook Choi ,  Jin-wook Yoon

发明人： Hee-sung Park ,  Jae-young Chang ,  Jong-in Jo ,  Han-kook Choi ,  Jin-wook Yoon

IPC分类号： H05K7/20 ,  H01L23/34

CPC分类号： H01L23/4006 ,  H01L23/467 ,  H01L23/473 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2224/73253

摘要： A heatsink assembly having a simple structure for coupling a heatsink and an electronic chip is provided with a heatsink which contacts an electronic chip mounted on a substrate and absorbs heat generated from the electronic chip; and a pressing member which is coupled to the substrate and comprises: a pressing cover for pressing the heatsink so that the heatsink can be secured to the electronic chip; and tension parts which extend from the pressing cover and exert a pressing force onto the pressing cover, when being coupled to the substrate.

摘要翻译： 具有用于耦合散热器和电子芯片的简单结构的散热器组件设置有与安装在基板上的电子芯片接触并吸收从电子芯片产生的热量的散热器; 以及联接到所述基板的按压构件，包括：用于按压所述散热器的按压盖，使得所述散热器能够固定到所述电子芯片; 以及张紧部，其从所述按压盖延伸并且当与所述基板结合时向所述按压盖施加按压力。

公开(公告)号：US08447052B2

公开(公告)日：2013-05-21

申请号：US13019364

申请日：2011-02-02

申请人： Gyeong-tae Lee ,  Jong-bae Kim ,  Jong-in Jo

发明人： Gyeong-tae Lee ,  Jong-bae Kim ,  Jong-in Jo

IPC分类号： H04R25/00

CPC分类号： H04R5/02 ,  H04R1/028 ,  H04R1/26 ,  H04R1/2811 ,  H04R3/04 ,  H04R5/04 ,  H04R2430/03 ,  H04R2499/15

摘要： An electronic device includes a sound plate switchable between a stand type and a hang type. In the electronic device, the sound plate has a coupled structure movable between a first arrangement, in which the sound plate functions as a stand and a second arrangement wherein the sound plate is disposed at the rear of a main body as a hang type. In the first arrangement, the sound plate emits a sound through a slit provided in a side surface of the sound plate, and in the second arrangement, the sound plate emits sound through an opening in a front surface of the sound plate which is perpendicular to the side surface of the sound plate.

摘要翻译： 电子设备包括可在支架型和挂式之间切换的声板。 在电子装置中，声板具有可在第一装置和第二装置之间移动的耦合结构，其中声板用作支架，而第二布置，其中声板布置在主体的后部作为悬挂式。 在第一布置中，声板通过设置在声板的侧表面中的狭缝发出声音，并且在第二布置中，声板通过声板的前表面中的开口发出声音，该开口垂直于 声板的侧面。

公开(公告)号：US20070070603A1

公开(公告)日：2007-03-29

申请号：US11519072

申请日：2006-09-12

申请人： Hee-sung Park ,  Jae-young Chang ,  Jong-in Jo ,  Han-kook Choi ,  Jin-wook Yoon

发明人： Hee-sung Park ,  Jae-young Chang ,  Jong-in Jo ,  Han-kook Choi ,  Jin-wook Yoon

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L23/467 ,  H01L23/473 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2224/73253

摘要： A heatsink assembly having a simple structure for coupling a heatsink and an electronic chip is provided with a heatsink which contacts an electronic chip mounted on a substrate and absorbs heat generated from the electronic chip; and a pressing member which is coupled to the substrate and comprises: a pressing cover for pressing the heatsink so that the heatsink can be secured to the electronic chip; and tension parts which extend from the pressing cover and exert a pressing force onto the pressing cover, when being coupled to the substrate.

摘要翻译： 具有用于耦合散热器和电子芯片的简单结构的散热器组件设置有与安装在基板上的电子芯片接触并吸收从电子芯片产生的热量的散热器; 以及联接到所述基板的按压构件，包括：用于按压所述散热器的按压盖，使得所述散热器能够固定到所述电子芯片; 以及张紧部，其从所述按压盖延伸并且当与所述基板结合时向所述按压盖施加按压力。