公开(公告)号：US06224472B1

公开(公告)日：2001-05-01

申请号：US09344297

申请日：1999-06-24

申请人： Lei Ping Lai ,  Joshua L. Tucker ,  Randall J. Lujan

发明人： Lei Ping Lai ,  Joshua L. Tucker ,  Randall J. Lujan

IPC分类号： B24B500

CPC分类号： B24B37/32

摘要： Methods and apparatus for chemical mechanical polishing of substrates, such as semiconductor wafers, which employ retaining rings to hold a substrate in place during the polishing process. The retaining rings have surface characteristics that may be used to improve polishing uniformity, especially at a wafer periphery, and/or to improve removal rate of a chemical mechanical polishing (“CMP”) system. The surface characteristics may be recesses and/or protrusions on the pad-facing surface of a CMP retaining ring, which during polishing contact and act to flatten a CMP polishing pad beneath the substrate. Near the edge the surface characteristics may also condition the surface of a polishing pad during polishing and may be further configured to improve slurry transport.

摘要翻译： 用于化学机械抛光的方法和装置，例如半导体晶片，其在抛光过程中采用保持环将基板保持在适当位置。 保持环具有可用于改善抛光均匀性，特别是在晶片周边处的表面特性和/或改善化学机械抛光（“CMP”）系统的去除速率。 表面特性可以是在CMP保持环的面向衬垫的表面上的凹陷和/或突起，其在抛光接触期间并且用于使CMP抛光垫在基底下方平坦化。 在边缘附近，表面特征也可以在抛光期间调节抛光垫的表面，并且可以进一步构造成改善浆料输送。