公开(公告)号：US06224472B1

公开(公告)日：2001-05-01

申请号：US09344297

申请日：1999-06-24

申请人： Lei Ping Lai ,  Joshua L. Tucker ,  Randall J. Lujan

发明人： Lei Ping Lai ,  Joshua L. Tucker ,  Randall J. Lujan

IPC分类号： B24B500

CPC分类号： B24B37/32

摘要： Methods and apparatus for chemical mechanical polishing of substrates, such as semiconductor wafers, which employ retaining rings to hold a substrate in place during the polishing process. The retaining rings have surface characteristics that may be used to improve polishing uniformity, especially at a wafer periphery, and/or to improve removal rate of a chemical mechanical polishing (“CMP”) system. The surface characteristics may be recesses and/or protrusions on the pad-facing surface of a CMP retaining ring, which during polishing contact and act to flatten a CMP polishing pad beneath the substrate. Near the edge the surface characteristics may also condition the surface of a polishing pad during polishing and may be further configured to improve slurry transport.

摘要翻译： 用于化学机械抛光的方法和装置，例如半导体晶片，其在抛光过程中采用保持环将基板保持在适当位置。 保持环具有可用于改善抛光均匀性，特别是在晶片周边处的表面特性和/或改善化学机械抛光（“CMP”）系统的去除速率。 表面特性可以是在CMP保持环的面向衬垫的表面上的凹陷和/或突起，其在抛光接触期间并且用于使CMP抛光垫在基底下方平坦化。 在边缘附近，表面特征也可以在抛光期间调节抛光垫的表面，并且可以进一步构造成改善浆料输送。

公开(公告)号：US07404757B2

公开(公告)日：2008-07-29

申请号：US10873557

申请日：2004-06-22

申请人： Randall J. Lujan

发明人： Randall J. Lujan

IPC分类号： B24B55/00

CPC分类号： B24B53/017 ,  B24B53/003

摘要： An apparatus for breaking in new pad conditioning disks for use in a chemical mechanical polishing (CMP) system that polishes a semiconductor wafer by pressing the semiconductor wafer against a moving polishing pad. The apparatus comprises a break-in head that is removably attached to a drive shaft to which a polishing head that holds the semiconductor wafer is normally attached. The break-in head holds multiple pad conditioning disks and presses the plurality of pad conditioning disks against the moving polishing pad. The break-in head comprises a drive mechanism for rotating the multiple pad conditioning disks. The drive mechanism is coupled to the drive shaft and rotates the multiple pad conditioning disks by translating a rotating motion of the drive shaft into rotating motions of the multiple pad conditioning disks.

摘要翻译： 一种用于打破用于化学机械抛光（CMP）系统的新的衬垫调节盘的装置，其通过将半导体晶片压靠移动的抛光垫来抛光半导体晶片。 该装置包括可拆卸地附接到保持半导体晶片正常安装的抛光头的驱动轴的插入头。 插入头保持多个垫调节盘并将多个垫调节盘压靠在移动的抛光垫上。 插入头包括用于旋转多个衬垫调节盘的驱动机构。 驱动机构联接到驱动轴并且通过将驱动轴的旋转运动转换成多个衬垫调节盘的旋转运动来旋转多个衬垫调节盘。

公开(公告)号：US07371156B2

公开(公告)日：2008-05-13

申请号：US11507360

申请日：2006-08-21

申请人： Randall J. Lujan

发明人： Randall J. Lujan

IPC分类号： B24B1/00

CPC分类号： B24B53/017 ,  B24B53/003

摘要： An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system. The off-line tool comprises a platen having a first surface for holding a polishing pad and a motor for rotating the polishing pad. The motor is coupled to the platen via a first drive shaft. The off-line tool further comprises a mechanical drive assembly for holding a second drive shaft in a position proximate the first surface of the platen and a first break-in head removably attached to the second drive shaft. The first break-in head receives a first pad conditioning disk and the second drive shaft moves the first break-in head toward the platen, thereby pressing the first pad conditioning disk against the polishing pad on the platen.

摘要翻译： 用于打破化学机械抛光（CMP）系统中使用的垫调节盘的离线工具。 离线工具包括具有用于保持抛光垫的第一表面和用于旋转抛光垫的电动机的压板。 电动机通过第一驱动轴联接到压板。 离线工具还包括用于将第二驱动轴保持在靠近压板的第一表面的位置的机械驱动组件以及可移除地附接到第二驱动轴的第一插入头。 第一插入头接收第一垫调节盘，第二驱动轴将第一插入头朝向压板移动，从而将第一垫调节盘压靠在压板上的抛光垫上。

公开(公告)号：US07094134B2

公开(公告)日：2006-08-22

申请号：US10873558

申请日：2004-06-22

申请人： Randall J. Lujan

发明人： Randall J. Lujan

IPC分类号： B24B1/00

CPC分类号： B24B53/017 ,  B24B53/003

摘要： An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system. The off-line tool comprises a platen having a first surface for holding a polishing pad and a motor for rotating the polishing pad. The motor is coupled to the platen via a first drive shaft. The off-line tool further comprises a mechanical drive assembly for holding a second drive shaft in a position proximate the first surface of the platen and a first break-in head removably attached to the second drive shaft. The first break-in head receives a first pad conditioning disk and the second drive shaft moves the first break-in head toward the platen, thereby pressing the first pad conditioning disk against the polishing pad on the platen.

摘要翻译： 用于打破化学机械抛光（CMP）系统中使用的垫调节盘的离线工具。 离线工具包括具有用于保持抛光垫的第一表面和用于旋转抛光垫的电动机的压板。 电动机通过第一驱动轴联接到压板。 离线工具还包括用于将第二驱动轴保持在靠近压板的第一表面的位置的机械驱动组件以及可移除地附接到第二驱动轴的第一插入头。 第一插入头接收第一垫调节盘，第二驱动轴将第一插入头朝向压板移动，从而将第一垫调节盘压靠在压板上的抛光垫上。