公开(公告)号：US06334480B1

公开(公告)日：2002-01-01

申请号：US09702859

申请日：2000-11-01

申请人： Geunbae Lim ,  Hayong Yun ,  Jung Hyun Lee ,  Yukeun Eugene Pak ,  Jung-sang Ko ,  Sung-jin Kim

发明人： Geunbae Lim ,  Hayong Yun ,  Jung Hyun Lee ,  Yukeun Eugene Pak ,  Jung-sang Ko ,  Sung-jin Kim

IPC分类号： F28F700

CPC分类号： H01L23/467 ,  F28F13/02 ,  F28F13/18 ,  F28F13/185 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.

公开(公告)号：US06425439B1

公开(公告)日：2002-07-30

申请号：US10029702

申请日：2001-12-31

申请人： Geunbae Lim ,  Hayong Yun ,  Jung Hyun Lee ,  Yukeun Eugene Pak ,  Jung-sang Ko ,  Sung-jin Kim

发明人： Geunbae Lim ,  Hayong Yun ,  Jung Hyun Lee ,  Yukeun Eugene Pak ,  Jung-sang Ko ,  Sung-jin Kim

IPC分类号： F28F700

CPC分类号： H01L23/467 ,  F28F13/02 ,  F28F13/18 ,  F28F13/185 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.

摘要翻译： 提供具有微型散热片的冷却装置。 冷却装置包括基板，从基板延伸的多个振动型散热片，以及鼓风机，用于使基板通风以冷却基板和振动型散热片，并使振动式散热片振动。 因此，形成在基板的表面上的微型散热片由于振动而改变空气的流动路径，提高了基板表面附近的热传递性能。 换句话说，通过干扰形成在光滑表面上的热边界层的形成，降低了传热阻力，提高了传热性能。 由于冷却装置与现有的冷却装置相比提供了改进的传热性能，所以可以减小用于传热的面积和体积，从而可以使冷却装置小型化。