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    Cooling device using capillary pumped loop
    1.
    发明授权
    Cooling device using capillary pumped loop 有权
    使用毛细管泵回路的冷却装置

    公开(公告)号：US06443222B1

    公开(公告)日：2002-09-03

    申请号：US09702860

    申请日：2000-11-01

    申请人： Hayong Yun ,  Geunbae Lim ,  Jung Hyun Lee ,  Yukeun Eugene Pak

    发明人： Hayong Yun ,  Geunbae Lim ,  Jung Hyun Lee ,  Yukeun Eugene Pak

    IPC分类号： E28D1500

    CPC分类号： F28D15/043 ,  H01L23/427 ,  H01L2224/29499

    摘要： A cooling device using a capillary pumped loop (CPL), including a lower board having a looped groove formed on the upper surface, an upper board combined with the upper surface of the lower board to cover the groove, so that the flow path of a working fluid is provided, an evaporator which is provided on the flow path, and has a plurality of fine evaporating fins incorporated into the upper or lower board, and a condenser which is provided on the flow path at a predetermined distance apart from the evaporator, and has a plurality of fine condensing fins incorporated into the upper or lower board. Accordingly, a thin and small cooling device capable of performing cooling without external power can be obtained. Also, various modifications of a simple micro channel attached to an evaporator eliminate a resistance on a flow path produced by an increase in the specific volume of a working fluid due to the phase change of the working fluid, and prevent a backward flow of the working fluid due to a rapid increase in pressure. Therefore, the entire cooling system can have hydrodynamic instability.

    摘要翻译： 一种使用毛细管泵回路（CPL）的冷却装置，包括在上表面上形成有环形槽的下板，与上板的上表面结合以覆盖槽的上板，从而使 提供了工作流体，设置在流路上的蒸发器，并且具有结合到上板或下板中的多个精细蒸发翅片和冷凝器，该冷凝器设置在与蒸发器隔开预定距离的流路上， 并且具有结合到上板或下板中的多个精细冷凝翅片。 因此，可以获得能够在没有外部电力的情况下进行冷却的薄型和小型冷却装置。 此外，附接到蒸发器的简单微通道的各种修改消除了由于工作流体的相变导致的工作流体的比容的增加而产生的流动路径上的阻​​力，并且防止了工作流体的反向流动 流体由于压力的快速增加。 因此，整个冷却系统可能具有流体动力学不稳定性。

    Cooling device with micro cooling fin
    2.
    发明授权
    Cooling device with micro cooling fin 有权
    带微冷却片的冷却装置

    公开(公告)号：US06425439B1

    公开(公告)日：2002-07-30

    申请号：US10029702

    申请日：2001-12-31

    申请人： Geunbae Lim ,  Hayong Yun ,  Jung Hyun Lee ,  Yukeun Eugene Pak ,  Jung-sang Ko ,  Sung-jin Kim

    发明人： Geunbae Lim ,  Hayong Yun ,  Jung Hyun Lee ,  Yukeun Eugene Pak ,  Jung-sang Ko ,  Sung-jin Kim

    IPC分类号： F28F700

    CPC分类号： H01L23/467 ,  F28F13/02 ,  F28F13/18 ,  F28F13/185 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.

    摘要翻译： 提供具有微型散热片的冷却装置。 冷却装置包括基板，从基板延伸的多个振动型散热片，以及鼓风机，用于使基板通风以冷却基板和振动型散热片，并使振动式散热片振动。 因此，形成在基板的表面上的微型散热片由于振动而改变空气的流动路径，提高了基板表面附近的热传递性能。 换句话说，通过干扰形成在光滑表面上的热边界层的形成，降低了传热阻力，提高了传热性能。 由于冷却装置与现有的冷却装置相比提供了改进的传热性能，所以可以减小用于传热的面积和体积，从而可以使冷却装置小型化。