公开(公告)号：US06326129B1

公开(公告)日：2001-12-04

申请号：US09526570

申请日：2000-03-16

申请人： Takashi Hirose ,  Junji Boshita ,  Norihisa Asano

发明人： Takashi Hirose ,  Junji Boshita ,  Norihisa Asano

IPC分类号： G02F11343

CPC分类号： G02F1/136227

摘要： A process for manufacturing an active element array substrate, such as for a display panel in a liquid crystal display device. The process comprises exposing photosensitive resin to an irradiation light from the rear face of the substrate and to another irradiation light applied from the front face of the substrate. The irradiation light from the front face of the substrate exposes a region encompassing substantially all of the pixel electrode extending from over a portion of the drain electrode to near the source and gate electrodes. This enables selective exposure of the photosensitive resin to the light from the front face even if scratches or dust exist on the rear face of the substrate during exposure to the light from the rear face, thus increasing the manufacturing yield of such active element array substrates.

摘要翻译： 一种有源元件阵列基板的制造方法，例如液晶显示装置中的显示面板。 该方法包括将感光树脂暴露于来自基板的背面的照射光和从基板的正面施加的另一照射光。 来自基板的前表面的照射光暴露了从漏电极的一部分延伸到源电极和栅电极附近的基本上全部的像素电极的区域。 即使在曝光于背面的光时，即使在基板的背面存在划痕或灰尘，也能够使感光性树脂选择性地曝光于来自前表面的光，从而提高了这种有源元件阵列基板的制造成品率。