公开(公告)号：US5403663A

公开(公告)日：1995-04-04

申请号：US274582

申请日：1994-07-13

申请人： Eggo Sichmann ,  Thomas Krug ,  Jurgen Meinel ,  Dan Costescu

发明人： Eggo Sichmann ,  Thomas Krug ,  Jurgen Meinel ,  Dan Costescu

IPC分类号： C23C14/20 ,  C23C14/34

CPC分类号： C23C14/205 ,  C23C14/3414 ,  Y10T428/31507

摘要： A DC source 10 connected to an electrode 5 is disposed in a coating chamber which can be evacuated. The electrode is electrically connected to a target 3 which is sputtered and the sputtered particles are deposited on the substrate, while a process gas is introduced in the coating chamber 15, 15a. The target is made of an aluminum-silicon alloy which may contain 0.5 to 2.0 percent silicon and 99.5 to 98.0 percent aluminum in order to improve the adhesive strength and the service life of the layer 2. The substrate may be made of polycarbonate.

摘要翻译： 连接到电极5的DC源10设置在可以被抽真空的涂覆室中。 电极与溅射的靶3电连接，溅射的粒子沉积在基板上，同时将处理气体引入涂覆室15,15a中。 靶材由铝 - 硅合金制成，其可以含有0.5-2.0％的硅和99.5-98.0％的铝，以提高层2的粘合强度和使用寿命。该基底可以由聚碳酸酯制成。