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19 条记录 (耗时 0.011 秒)

    Device for cathode sputtering
    2.
    发明授权
    Device for cathode sputtering 失效
    阴极溅射装置

    公开(公告)号：US5863399A

    公开(公告)日：1999-01-26

    申请号：US833985

    申请日：1997-04-11

    申请人： Eggo Sichmann

    发明人： Eggo Sichmann

    IPC分类号： H01J37/34 ,  C23C14/34

    CPC分类号： H01J37/3452 ,  H01J37/3408

    摘要： A device for cathode sputtering for producing coatings on a substrate 27 by means of a sputtering cathode, which device can be introduced into a vacuum chamber and has magnets or ring magnets 9, 13 concentrically arranged in respect to the center axis 44 of the sputtering cathode, pole shoes 14 and a target 8. The target has a front surface 41 with at least a surface portion which is inclined with respect to the back surface 40 of the target. In the area of the back surface 40 of the target at least one second, outer ring magnet 42 with a larger diameter is provided in addition to the inner ring magnets 9, 13.

    摘要翻译： 一种用于通过溅射阴极在衬底27上生产涂层的阴极溅射器件，该器件可以被引入到真空室中，并且具有相对于溅射阴极的中心轴线44同心布置的磁体或环形磁体9,13 ，极靴14和目标8.目标具有前表面41，其具有至少一个相对于目标的后表面40倾斜的表面部分。 除了内圈磁铁9,13之外，在目标的后表面40的区域中还设置有至少一个第二外径较大直径的外圈磁铁42。

    Device for surface coating or lacquering of substrates
    3.
    发明授权
    Device for surface coating or lacquering of substrates 失效
    用于表面涂覆或涂漆的装置

    公开(公告)号：US5863328A

    公开(公告)日：1999-01-26

    申请号：US801585

    申请日：1997-02-18

    申请人： Eggo Sichmann ,  Reinhard Gerigk

    发明人： Eggo Sichmann ,  Reinhard Gerigk

    IPC分类号： B05B15/10 ,  B05C11/08 ,  B05C11/10 ,  G03F7/16 ,  B05C5/00

    CPC分类号： B05C11/1039 ,  B05B15/10 ,  B05C11/08 ,  G03F7/162

    摘要： Apparatus for surface coating or for lacquering of a substrate, such as a disk-shaped substrate 2, which can be placed on a substrate support 14 and can be driven or made to perform a rotating movement, wherein the medium to be applied or the lacquer fluid is applied to the substrate 2 via a feed device 6 which can be displaced in relation to the substrate 2 and/or can be driven. The substrate 2 or the substrate support 14 can be displaced by means of a guide device or in a connecting link guide 7 in such a way that in the area of the substrate 2 the feed device 6 for applying the fluid or the lacquer is conducted approximately parallel with the surface of the substrate 2 and can be stopped at any arbitrary point above the substrate 2 at an even height distance.

    摘要翻译： 用于表面涂覆或用于涂覆诸如盘形基底2的基底的装置，其可以放置在基底支撑件14上并且可以被驱动或制成进行旋转运动，其中待施加的介质或者漆 流体通过可相对于基板2移位和/或可被驱动的进给装置6施加到基板2。 基板2或基板支撑件14可以通过引导装置或连接引导件7以这样的方式移位，使得在基板2的区域中，用于施加流体或涂漆的进给装置6大致进行 与基板2的表面平行，并且可以以均匀的高度距离停止在基板2上方的任意任意点处。

    Sputtering cathode
    4.
    发明授权
    Sputtering cathode 失效
    溅射阴极

    公开(公告)号：US5266178A

    公开(公告)日：1993-11-30

    申请号：US827134

    申请日：1992-01-28

    申请人： Eggo Sichmann

    发明人： Eggo Sichmann

    IPC分类号： C23C14/35 ,  H01J37/34 ,  C23C14/34

    CPC分类号： H01J37/347 ,  H01J37/3408

    摘要： The invention relates to a sputtering cathode for coating substrates in cathode sputtering apparatus, with a cathode base body 5, a target of nonmagnetic material disposed thereon and having at least one flat sputtering surface 9a, a magnet system 7 with pole faces 7c, 7d, of opposite polarity lying on both sides of the target margins for the production of a closed tunnel of magnetic lines of force overarching the sputtering surface 9a, while the pole shoes 23, 24, surrounding the target reach at least to the outer boundary of the target 9 or partially overlap the latter.

    摘要翻译： 本发明涉及一种用于在阴极溅射装置中涂覆基板的溅射阴极，阴极基体5，设置在其上的非磁性材料的靶，具有至少一个平坦溅射表面9a，具有极面7c，7d的磁体系统7， 相反极性位于目标边缘的两侧，用于产生覆盖溅射表面9a的磁力线的封闭通道，而围绕目标的极靴23,24至少达到目标的外边界 9或部分与后者重叠。

    Method for coating polymethylmethacrylate substrate with aluminum
    5.
    发明授权
    Method for coating polymethylmethacrylate substrate with aluminum 失效
    用铝涂覆聚甲基丙烯酸甲酯基材的方法

    公开(公告)号：US5074984A

    公开(公告)日：1991-12-24

    申请号：US449785

    申请日：1989-12-13

    申请人： Eggo Sichmann ,  Thomas Krug ,  Wolf-Eckart Fritsche ,  Martin Pollmann

    发明人： Eggo Sichmann ,  Thomas Krug ,  Wolf-Eckart Fritsche ,  Martin Pollmann

    IPC分类号： C23C14/20 ,  C23C14/34 ,  C23C14/35

    CPC分类号： C23C14/35 ,  C23C14/205

    摘要： In a device for coating a substrate 1 made of polymethylmethacrylate with aluminum by means of a direct current source 10 which is connected to an electrode 5 disposed in an evacuable coating chamber 15a and electrically connected to a target 3 to be sputtered and the sputtered particles are deposited on a substrate 1 and wherein a process gas is introduced into the coating chamber (15, 15a), helium has is introduced as a process gas in order to improve adhesiveness and service life 2.

    摘要翻译： 在通过直流电源10涂覆由聚甲基丙烯酸甲酯制成的基板1的装置中，所述直流电源10连接到设置在可抽出的涂覆室15a中并电连接到待溅射的靶3并且溅射的颗粒的电极5 沉积在基板1上，并且其中将工艺气体引入涂覆室（15,15a）中，引入氦气作为工艺气体，以改善粘附性和使用寿命2。

    Process for coating a substrate with electrically conductive materials
    6.
    发明授权
    Process for coating a substrate with electrically conductive materials 失效
    用导电材料涂覆基板的方法

    公开(公告)号：US5006213A

    公开(公告)日：1991-04-09

    申请号：US401050

    申请日：1989-08-31

    申请人： Eggo Sichmann ,  Thomas Krug ,  Stephan Kempf

    发明人： Eggo Sichmann ,  Thomas Krug ,  Stephan Kempf

    IPC分类号： C23C14/14 ,  C23C14/35

    CPC分类号： C23C14/3492 ,  C23C14/14 ,  C23C14/35

    摘要： A DC source 10 is connected to an electrode 5 disposed in a coating chamber 15a which can be evacuated and this electrode is electrically connected to an aluminum target 3 which is sputtered by introduction of a process gas and the sputtered particles deposited onto a plastic substrate. During the coating process hydrogen and/or water vapor are supplied to the cathode area from a container 32 via a system of pipes 30 to increase the adhesive strength of the sputtered layer 2 on the substrate 1.

    摘要翻译： DC源10连接到设置在可以抽真空的涂覆室15a中的电极5上，该电极与通过引入处理气体和溅射的颗粒沉积在塑料基板上溅射的铝靶3电连接。 在涂覆过程中，氢和/或水蒸汽通过管道30从容器32供应到阴极区域，以增加溅射层2在基底1上的粘合强度。

    Magnetron sputtering cathode with magnet disposed between two yoke plates
    8.
    发明授权
    Magnetron sputtering cathode with magnet disposed between two yoke plates 有权
    磁控溅射阴极，配有两个磁轭之间的磁铁

    公开(公告)号：US06344114B1

    公开(公告)日：2002-02-05

    申请号：US09331453

    申请日：1999-08-30

    申请人： Eggo Sichmann ,  Michael Muecke ,  Wolfgang Becker ,  Klaus Truckenmueller

    发明人： Eggo Sichmann ,  Michael Muecke ,  Wolfgang Becker ,  Klaus Truckenmueller

    IPC分类号： C23C1434

    CPC分类号： H01J37/3455 ,  C23C14/35 ,  H01J37/3408 ,  H01J37/3458

    摘要： A method of coating a substrate by magnetron cathode sputtering includes a sputtering cathode having pole shoes and being arranged in a vacuum chamber. A target and a magnetic field are provided in an area of the surface of the target and the magnetic field is varied stepwise and/or continuously to displace the plasma radially such that the erosion groove is likewise displaced radially. The variable magnetic field is generated by coils between the back surface of the target and a yoke plate while a static magnetic field is gernated by an annularly arranged magnet in the area of the yoke plate and a target space between the target and the substrate is shielded by means of an iron core which also increases the field strength of the variable magnetic field.

    摘要翻译： 通过磁控管阴极溅射涂覆基板的方法包括具有极靴并设置在真空室中的溅射阴极。 在靶的表面的区域中设置靶和磁场，并且磁场逐步和/或连续地变化以使等离子体径向偏移，使得侵蚀槽同样地径向偏移。 可变磁场由目标的背面和磁轭板之间的线圈产生，而磁轭在磁轭板的区域中被环形排列的磁体所固定，并且目标和衬底之间的目标空间被屏蔽 借助于铁心也增加了可变磁场的场强。

    Device for surface coating or lacquering of substrates
    9.
    发明授权
    Device for surface coating or lacquering of substrates 失效
    用于表面涂覆或涂漆的装置

    公开(公告)号：US5766359A

    公开(公告)日：1998-06-16

    申请号：US802790

    申请日：1997-02-18

    申请人： Eggo Sichmann ,  Reinhard Gerigk

    发明人： Eggo Sichmann ,  Reinhard Gerigk

    IPC分类号： B05C11/08 ,  B05C11/10 ,  B05C5/00

    CPC分类号： B05C11/1039 ,  B05C11/08 ,  B05C11/10 ,  B05C11/1042

    摘要： An apparatus for surface coating or for lacquering a substrate, such as a disk-shaped substrate 2, which can be placed on a substrate carrier 14 and can be driven or given a rotating movement by means of a drive device, wherein the material or the lacquer fluid 5 to be applied is placed on the substrate 2 from a feed device 6. The fluid medium or the lacquer 4 released by the substrate support 14 is delivered at least to a first collecting reservoir 17 which is connected with at least one filter 28, from where the fluid is indirectly or directly conducted via a pump 29 to the first collecting reservoir 27, wherein an underpressure can be set between a first flow-off line 33 of the first collecting reservoir 27 and the pump 29.

    摘要翻译： 用于表面涂覆或用于对基板（例如盘状基板2）进行涂漆的装置，其可以放置在基板载体14上并且可以通过驱动装置被驱动或给予旋转运动，其中所述材料或 要施加的漆流体5从进料装置6放置在基板2上。由基板支撑件14释放的流体介质或漆4至少被输送到第一收集容器17，该收集容器17与至少一个过滤器28连接 从液体经由泵29间接地或直接地通过泵29传导到第一收集容器27，其中可以在第一收集容器27的第一流出物流33和泵29之间设置负压。

    Process for coating a polycarbonate substrate with an aluminum-silicon alloy
    10.
    发明授权
    Process for coating a polycarbonate substrate with an aluminum-silicon alloy 失效
    用铝硅合金涂覆聚碳酸酯基材的方法

    公开(公告)号：US5403663A

    公开(公告)日：1995-04-04

    申请号：US274582

    申请日：1994-07-13

    申请人： Eggo Sichmann ,  Thomas Krug ,  Jurgen Meinel ,  Dan Costescu

    发明人： Eggo Sichmann ,  Thomas Krug ,  Jurgen Meinel ,  Dan Costescu

    IPC分类号： C23C14/20 ,  C23C14/34

    CPC分类号： C23C14/205 ,  C23C14/3414 ,  Y10T428/31507

    摘要： A DC source 10 connected to an electrode 5 is disposed in a coating chamber which can be evacuated. The electrode is electrically connected to a target 3 which is sputtered and the sputtered particles are deposited on the substrate, while a process gas is introduced in the coating chamber 15, 15a. The target is made of an aluminum-silicon alloy which may contain 0.5 to 2.0 percent silicon and 99.5 to 98.0 percent aluminum in order to improve the adhesive strength and the service life of the layer 2. The substrate may be made of polycarbonate.

    摘要翻译： 连接到电极5的DC源10设置在可以被抽真空的涂覆室中。 电极与溅射的靶3电连接，溅射的粒子沉积在基板上，同时将处理气体引入涂覆室15,15a中。 靶材由铝 - 硅合金制成，其可以含有0.5-2.0％的硅和99.5-98.0％的铝，以提高层2的粘合强度和使用寿命。该基底可以由聚碳酸酯制成。