公开(公告)号：US20130026589A1

公开(公告)日：2013-01-31

申请号：US13243800

申请日：2011-09-23

Applicant: YING-CHENG WU ,  KANG-WEI LEE

Inventor： YING-CHENG WU ,  KANG-WEI LEE

IPC: H01L31/0232 ,  H01L31/18

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A miniaturization active sensing module includes a substrate unit, an active sensing unit, and an optical unit. The substrate unit includes a substrate body, a plurality of first bottom conductive pads disposed on the bottom side of the substrate body, and a plurality of first conductive tracks embedded in the substrate body. The substrate body has at least one first groove formed therein. The active sensing unit includes at least one active sensing chip embedded in the first groove. The active sensing chip has at least one active sensing area and a plurality of electric conduction pads disposed on the top side thereof, and each first conductive track has two ends electrically contacted by one electric conduction pad and one first bottom conductive pad, respectively. The optical unit includes at least one optical element, disposed on the substrate body, for protecting the active sensing area.

Abstract translation: 小型化主动感测模块包括基板单元，主动感测单元和光学单元。 基板单元包括基板主体，设置在基板主体的底侧上的多个第一底部导电焊盘以及嵌入基板主体中的多个第一导电轨迹。 衬底主体具有形成在其中的至少一个第一凹槽。 主动感测单元包括嵌入第一凹槽中的至少一个主动感测芯片。 主动感测芯片具有至少一个有源感测区域和设置在其顶侧上的多个导电焊盘，并且每个第一导电轨道具有分别由一个导电焊盘和一个第一底部导电焊盘电接触的两个端部。 光学单元包括设置在基板主体上的至少一个光学元件，用于保护主动感测区域。