公开(公告)号：US09425070B2

公开(公告)日：2016-08-23

申请号：US13005841

申请日：2011-01-13

申请人： Yoshimichi Harada ,  Makoto Murai ,  Takayuki Tanaka ,  Kana Nagayoshi ,  Takuya Nakamura

发明人： Yoshimichi Harada ,  Makoto Murai ,  Takayuki Tanaka ,  Kana Nagayoshi ,  Takuya Nakamura

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed herein is a semiconductor device, including: a mount body having a first principal surface on which a wiring pattern is formed; a semiconductor chip mounted above the principal surface of the mount body on which the wiring pattern is formed; an underfill material filled between the mount body and the semiconductor chip, thereby forming a fillet in an outer peripheral portion of the semiconductor chip; and an introduction portion formed outside a side portion, along which the fillet is formed so as to be longest, of four side portions which measure a chip mounting area, on the mount body, onto which the semiconductor chip is mounted, the introduction portion serving to introduce the underfill material between the mount body and the semiconductor chip.

摘要翻译： 这里公开了一种半导体器件，包括：安装体，其具有形成布线图案的第一主表面; 半导体芯片安装在其上形成有布线图案的安装体的主表面上方; 填充在安装体和半导体芯片之间的底部填充材料，从而在半导体芯片的外周部分形成圆角; 以及引导部，其形成在所述圆角部分的外侧，所述边缘沿着所述边缘形成为最长，在安装有所述半导体芯片的所述安装体上测量芯片安装面积的四个侧部，所述引入部分服务 以在底座和半导体芯片之间引入底部填充材料。

公开(公告)号：US20110175239A1

公开(公告)日：2011-07-21

申请号：US13005841

申请日：2011-01-13

申请人： Yoshimichi Harada ,  Makoto Murai ,  Takayuki Tanaka ,  Kana Nagayoshi ,  Takuya Nakamura

发明人： Yoshimichi Harada ,  Makoto Murai ,  Takayuki Tanaka ,  Kana Nagayoshi ,  Takuya Nakamura

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L21/563 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed herein is a semiconductor device, including: a mount body having a first principal surface on which a wiring pattern is formed; a semiconductor chip mounted above the principal surface of the mount body on which the wiring pattern is formed; an underfill material filled between the mount body and the semiconductor chip, thereby forming a fillet in an outer peripheral portion of the semiconductor chip; and an introduction portion formed outside a side portion, along which the fillet is formed so as to be longest, of four side portions which measure a chip mounting area, on the mount body, onto which the semiconductor chip is mounted, the introduction portion serving to introduce the underfill material between the mount body and the semiconductor chip.

摘要翻译： 这里公开了一种半导体器件，包括：安装体，其具有形成布线图案的第一主表面; 半导体芯片安装在其上形成有布线图案的安装体的主表面上方; 填充在安装体和半导体芯片之间的底部填充材料，从而在半导体芯片的外周部分形成圆角; 以及引导部，其形成在所述圆角部分的外侧，所述边缘沿着所述边缘形成为最长，在安装有所述半导体芯片的所述安装体上测量芯片安装面积的四个侧部，所述引入部分服务 以在底座和半导体芯片之间引入底部填充材料。