公开(公告)号：US20070199860A1

公开(公告)日：2007-08-30

申请号：US10593973

申请日：2005-03-25

申请人： Satoshi Asari ,  Katsuhiko Mihara ,  Hiroshi Kikuchi

发明人： Satoshi Asari ,  Katsuhiko Mihara ,  Hiroshi Kikuchi

IPC分类号： B65D85/00

CPC分类号： H01L21/67757 ,  F27B5/04 ,  F27B5/12 ,  F27B5/13 ,  F27B17/0025 ,  H01L21/67781 ,  H01L21/68707

摘要： Disclosed is an improved transfer mechanism 21 that transfers, in a vertical heat treatment system, process objects W between a container (carrier) 16 for containing therein plural process objects, and a holder (boat) 9 for holding plural process objects at vertical intervals via ring-shaped support plates 15. The transfer mechanism 21 includes plural substrate support devices 21 spaced at intervals, and each of the substrate support devices 21 has a gripping mechanism 28 for gripping a process object W on the under side of the respective one of the substrate support devices 20. The gripping mechanism 28 includes a fixed engagement member 30 fixedly provided on a distal end of the substrate support device 20 to be engaged with a front edge of a process object W, and a movable engagement member 31 movably attached to a proximal end of the substrate support device 20 to be engaged with a rear edge of the process object W. Plural process objects W can be rapidly, securely transferred at the same time. A simple structure of the gripping mechanism 28 reduces the thickness of the substrate support device 21, so that the intervals of the ring-shaped support plates 15 can be reduced. Thus, the number of process objects to be simultaneously treated in a heat treatment furnace can be increased. As a result, improvement in throughput can be achieved.

摘要翻译： 公开了一种改进的传送机构21，其在垂直热处理系统中，在用于容纳多个处理物体的容器（载体）16和用于以垂直间隔保持多个处理物体的保持器（船）9） 环形支撑板15。 传送机构21包括间隔开的多个基板支撑装置21，并且每个基板支撑装置21具有夹持机构28，用于夹持基板支撑装置20的相应一个的下侧上的处理对象W。 夹持机构28包括固定地设置在基板支撑装置20的远端上以与处理对象W的前边缘接合的固定接合构件30和可移动地附接到基板的近端的可动接合构件31 支撑装置20与加工对象W的后边缘接合。可以同时快速，可靠地传送多个处理对象W。 夹持机构28的简单结构减小了基板支撑装置21的厚度，从而可以减小环形支撑板15的间隔。 因此，可以提高在热处理炉中同时处理的加工对象的数量。 结果，可以实现吞吐量的提高。

公开(公告)号：US07547209B2

公开(公告)日：2009-06-16

申请号：US10593901

申请日：2005-03-25

申请人： Satoshi Asari ,  Katsuhiko Mihara ,  Hiroshi Kikuchi

发明人： Satoshi Asari ,  Katsuhiko Mihara ,  Hiroshi Kikuchi

IPC分类号： F27D3/00

CPC分类号： H01L21/68707 ,  B25J9/163 ,  G05B2219/36039 ,  G05B2219/37555 ,  G05B2219/40519 ,  G05B2219/45031 ,  G05B2219/45063 ,  H01L21/67259 ,  H01L21/67265 ,  H01L21/67757 ,  H01L21/67781 ,  H01L21/681

摘要： A transfer mechanism 21 of a vertical heat treatment system 1 includes a base capable of vertical movement and turning movement, and plural substrate support devices, disposed on the base so as to be movable anteroposterior, that hold wafers W. Provided on the base 25 is a first sensor 45 that emits a light beam directed toward a direction in which the substrate support device 20 moves anteroposterior, and detects the target member upon receipt of a reflected light of the light beam. Provided on two tip end portions of the substrate support device 20 is a second sensor 40 that detects the target member upon interruption of a light beam traveling between the tip end portions by the target member. When a target member 44 provided at its specific positions with projections 49 and 50 is placed at a position in a wafer boat 8, the base 25 moves vertically and turns, and the substrate support device 20 moves anteroposterior. The position of the target member, or the transfer target position of the wafer, is automatically detected based on the detection signals of the first sensor 45 and the second sensor obtained at the time and encoder values of drive systems relating to the movement of the base 25 and the substrate support member 20.

摘要翻译： 垂直热处理系统1的传送机构21包括能够垂直移动和转动的基座，以及多个基板支撑装置，其设置在基座上，以便能够前后移动，保持晶片W.在基座25上设置 发射朝向基板支撑装置20前后移动的方向的光束的第一传感器45，并且在接收到光束的反射光时检测目标构件。 在基板支撑装置20的两个前端部设置有第二传感器40，该第二传感器40在由目标构件在前端部之间行进的光束中断时检测目标构件。 当设置在其具有突起49和50的特定位置的目标构件44被放置在晶片舟8中的位置时，基座25垂直移动并转动，并且衬底支撑装置20前后移动。 基于当时获得的第一传感器45和第二传感器的检测信号以及与基座的移动有关的驱动系统的编码器值，自动检测目标构件的位置或晶片的传送目标位置 25和基板支撑构件20。

公开(公告)号：US07416405B2

公开(公告)日：2008-08-26

申请号：US11630146

申请日：2005-06-20

申请人： Satoshi Asari ,  Katsuhiko Mihara

发明人： Satoshi Asari ,  Katsuhiko Mihara

IPC分类号： F27D3/12

CPC分类号： H01L21/67178 ,  H01L21/67109 ,  H01L21/67757 ,  H01L21/67781 ,  Y10S414/135 ,  Y10S414/138

摘要： A vertical type of thermal processing apparatus of the present invention includes a thermal processing furnace having a furnace opening at a lower portion thereof. A boat holding objects to be processed in a tier-like manner in a vertical direction is adapted to be contained in the thermal processing furnace through the furnace opening. A lid supporting the boat is capable of closing the furnace opening. A transferring chamber is connected to the furnace opening. An elevating mechanism provided in the transferring chamber is configured to move up and down the lid in order to load and unload the boat into and out from the thermal processing furnace. A connecting port provided at a wall of the transferring chamber is capable of being connected to an opening of a conveying container for containing the objects to be processed. A first containing portion provided in the transferring chamber is capable of temporarily containing unprocessed objects to be processed for a next thermal process. A second containing portion provided in the transferring chamber is capable of temporarily containing processed objects to be processed conveyed out from the thermal processing furnace. A transferring mechanism transfers objects to be processed between the conveying container, the first containing portion, the second containing portion and the boat.

摘要翻译： 本发明的立式热处理装置包括在其下部具有炉开口的热处理炉。 沿着垂直方向以层状方式保持待加工物体的船适于通过炉开口容纳在热处理炉中。 支撑船的盖子能够关闭炉子开口。 传送室连接到炉口。 设置在传送室中的升降机构被构造成上下移动盖子，以便将船体加载和卸载到热处理炉中。 设置在传送室的壁上的连接口能够连接到用于容纳待处理物体的输送容器的开口。 设置在传送室中的第一容纳部分能够临时包含待处理的待处理物体用于下一个热处理。 设置在传送室中的第二容纳部能够暂时包含从热处理炉输出的被处理物。 传送机构在输送容器，第一容纳部分，第二容纳部分和船之间传送待加工的物体。

公开(公告)号：US5788448A

公开(公告)日：1998-08-04

申请号：US568335

申请日：1995-12-06

申请人： Tsutomu Wakamori ,  Hiroyuki Iwai ,  Katsuhiko Mihara

发明人： Tsutomu Wakamori ,  Hiroyuki Iwai ,  Katsuhiko Mihara

IPC分类号： B65G49/07 ,  H01L21/02 ,  H01L21/673 ,  H01L21/677 ,  H01L21/00

CPC分类号： H01L21/67757 ,  H01L21/67769 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A processing apparatus is provided with a reaction furnace for subjecting semiconductor wafers, which are objects to be processed, to a predetermined processing; a storage rack for storing carriers (wafer cassettes), each containing a predetermined number of semiconductor wafers; and a conveyor for conveying the carriers into and out of the reaction furnace and the storage rack. In this case, a second conveyor mechanism, which comprises the storage portion and at least part of the conveyor, and a third conveyor mechanism are disposed within a sealed chamber in such a manner that they are isolated from the outer atmosphere. An exchange chamber that can be isolated from the outer atmosphere is further provided, for temporarily storing carriers that are to be conveyed into or out of the storage portion, through the sealed chamber via a communicating port. The interiors of the sealed chamber and the exchange chamber are formed so that they can be supplied with nitrogen. This ensures that unprocessed and processed semiconductor wafers can be held in an inert gas environment, so that contamination of the semiconductor wafers by organic substances and heavy metals can be prevented.

摘要翻译： 一种处理装置设置有用于将作为处理对象的半导体晶片经受预定处理的反应炉; 用于存储每个包含预定数量的半导体晶片的载体（晶片盒）的存储架; 以及用于将载体输送到反应炉和存储架中的输送机。 在这种情况下，包括存储部分和输送机的至少一部分的第二输送机构和第三输送机构以与外部大气隔离的方式设置在密封室内。 进一步设置有可以与外部大气隔离的交换室，用于通过连通口临时存储要被输送进出储存部的载体。 密封室和交换室的内部形成为能够供应氮气。 这确保未处理和处理的半导体晶片能够保持在惰性气体环境中，从而可以防止有机物质和重金属对半导体晶片的污染。

公开(公告)号：US20070273892A1

公开(公告)日：2007-11-29

申请号：US10593901

申请日：2005-03-25

申请人： Satoshi Asari ,  Katsuhiko Mihara ,  Hiroshi Kikuchi

发明人： Satoshi Asari ,  Katsuhiko Mihara ,  Hiroshi Kikuchi

IPC分类号： G01B11/14

CPC分类号： H01L21/68707 ,  B25J9/163 ,  G05B2219/36039 ,  G05B2219/37555 ,  G05B2219/40519 ,  G05B2219/45031 ,  G05B2219/45063 ,  H01L21/67259 ,  H01L21/67265 ,  H01L21/67757 ,  H01L21/67781 ,  H01L21/681

摘要： A transfer mechanism 21 of a vertical heat treatment system 1 includes a base capable of vertical movement and turning movement, and plural substrate support devices, disposed on the base so as to be movable anteroposterior, that hold wafers W. Provided on the base 25 is a first sensor 45 that emits a light beam directed toward a direction in which the substrate support device 20 moves anteroposterior, and detects the target member upon receipt of a reflected light of the light beam. Provided on two tip end portions of the substrate support device 20 is a second sensor 40 that detects the target member upon interruption of a light beam traveling between the tip end portions by the target member. When a target member 44 provided at its specific positions with projections 49 and 50 is placed at a position in a wafer boat 8, the base 25 moves vertically and turns, and the substrate support device 20 moves anteroposterior. The position of the target member, or the transfer target position of the wafer, is automatically detected based on the detection signals of the first sensor 45 and the second sensor obtained at the time and encoder values of drive systems relating to the movement of the base 25 and the substrate support member 20.

摘要翻译： 垂直热处理系统1的传送机构21包括能够垂直移动和转动的基座，以及多个基板支撑装置，其设置在基座上，以便能够前后移动，保持晶片W.在基座25上设置 发射朝向基板支撑装置20前后移动的方向的光束的第一传感器45，并且在接收到光束的反射光时检测目标构件。 在基板支撑装置20的两个前端部设置有第二传感器40，该第二传感器40在由目标构件在前端部之间行进的光束中断时检测目标构件。 当设置在其具有突起49和50的特定位置的目标构件44被放置在晶片舟8中的位置时，基座25垂直移动并转动，并且衬底支撑装置20前后移动。 基于当时获得的第一传感器45和第二传感器的检测信号以及与基座的移动有关的驱动系统的编码器值，自动检测目标构件的位置或晶片的传送目标位置 25和基板支撑构件20。

公开(公告)号：US5829969A

公开(公告)日：1998-11-03

申请号：US835820

申请日：1997-04-16

申请人： Masahiro Miyashita ,  Kenichi Yamaga ,  Katsuhiko Mihara

发明人： Masahiro Miyashita ,  Kenichi Yamaga ,  Katsuhiko Mihara

IPC分类号： C30B35/00 ,  F27D5/00

CPC分类号： C30B35/005

摘要： A vertical heat treating apparatus includes a first boat elevator for carrying a first wafer boat between a wafer transfer region and a predetermined position in a heat treating furnace, and a second boat elevator for carrying a second wafer boat between the wafer transfer region and the predetermined position in the heat treating furnace. With this construction, it is possible to eliminate the problems of causing the position shift of the wafer boat, so that and it is possible to prevent the wafer boat from overturning. The apparatus also has cutouts formed in the lower end portion of the wafer boat, and guide members formed on the upper surface of a wafer transfer stage so as to be engageable with the cutouts. With this construction, if the positioning is forcibly carried out when the wafer boat is loaded on the wafer transfer stage, it is possible to correct the position shift to prevent the shift from accumulating, so that it is possible to prevent the wafer boat from overturning.

摘要翻译： 一种立式热处理装置包括：第一船用电梯，用于在晶片转印区域和热处理炉中的预定位置之间承载第一晶片舟;以及第二舟形升降机，用于将晶片转移区域与预定的 在热处理炉中的位置。 通过这种结构，可以消除引起晶片舟的位置偏移的问题，从而可以防止晶片舟倒塌。 该设备还具有形成在晶片舟皿的下端部分中的切口，以及形成在晶片传送台的上表面上以便与切口接合的引导部件。 利用这种结构，当晶片舟装载在晶片传送台上时，如果强制执行定位，则可以校正位置偏移以防止偏移积聚，从而可以防止晶片舟翻倒 。

公开(公告)号：US5378145A

公开(公告)日：1995-01-03

申请号：US89827

申请日：1993-07-12

申请人： Yuji Ono ,  Katsuhiko Mihara

发明人： Yuji Ono ,  Katsuhiko Mihara

IPC分类号： C23C16/54 ,  H01L21/677 ,  H01L21/687 ,  F27B9/04

CPC分类号： H01L21/67757 ,  C23C16/54 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/67781 ,  H01L21/68707

摘要： A treatment system is disclosed, which has a treatment apparatus for performing a predetermined treatment for a planar workpiece contained in a carrier, and an first air-tight carrier storage chamber for storing the carrier. The treatment apparatus may also have an air-tight second carrier storage chamber. An inert gas supply and an exhaust means are connected to each of the treatment apparatus, the first carrier storage chamber, and the second carrier storage chamber. A valve device is provided for the inert gas supply and exhaust means.

摘要翻译： 公开了一种处理系统，其具有用于对包含在载体中的平面工件进行预定处理的处理装置和用于存储载体的第一气密载体存放室。 处理装置也可以具有气密的第二载体储存室。 惰性气体供给和排气装置连接到处理装置，第一载体储存室和第二载体储存室中的每一个。 为惰性气体供给和排气装置提供阀装置。

公开(公告)号：US07677858B2

公开(公告)日：2010-03-16

申请号：US10593973

申请日：2005-03-25

申请人： Satoshi Asari ,  Katsuhiko Mihara ,  Hiroshi Kikuchi

发明人： Satoshi Asari ,  Katsuhiko Mihara ,  Hiroshi Kikuchi

IPC分类号： B66C17/08

CPC分类号： H01L21/67757 ,  F27B5/04 ,  F27B5/12 ,  F27B5/13 ,  F27B17/0025 ,  H01L21/67781 ,  H01L21/68707

摘要： Disclosed is an improved transfer mechanism that transfers, in a vertical heat treatment system, process objects W between a container (carrier), and a holder (boat) holding plural process objects at vertical intervals. The transfer mechanism includes plural substrate support devices spaced at intervals, and each of the substrate support devices has a gripping mechanism for gripping a process object on the under side. The gripping mechanism includes a fixed engagement member on a distal end of the substrate support device, and a movable engagement member movably attached to a proximal end of the substrate support device.

摘要翻译： 公开了一种改进的传送机构，其在垂直热处理系统中传送在容器（托架）和以垂直间隔保持多个处理对象的保持器（船）之间的处理物体W. 传送机构包括间隔开的多个基板支撑装置，并且每个基板支撑装置具有用于夹持下侧的处理物体的夹持机构。 夹持机构包括在基板支撑装置的远端上的固定接合构件和可移动地连接到基板支撑装置的近端的可移动接合构件。

公开(公告)号：US20070231763A1

公开(公告)日：2007-10-04

申请号：US11630146

申请日：2005-06-20

申请人： Satoshi Asari ,  Katsuhiko Mihara

发明人： Satoshi Asari ,  Katsuhiko Mihara

IPC分类号： F27D3/12

CPC分类号： H01L21/67178 ,  H01L21/67109 ,  H01L21/67757 ,  H01L21/67781 ,  Y10S414/135 ,  Y10S414/138

摘要： A vertical type of thermal processing apparatus of the present invention includes a thermal processing furnace having a furnace opening at a lower portion thereof. A boat holding objects to be processed in a tier-like manner in a vertical direction is adapted to be contained in the thermal processing furnace through the furnace opening. A lid supporting the boat is capable of closing the furnace opening. A transferring chamber is connected to the furnace opening. An elevating mechanism provided in the transferring chamber is configured to move up and down the lid in order to load and unload the boat into and out from the thermal processing furnace. A connecting port provided at a wall of the transferring chamber is capable of being connected to an opening of a conveying container for containing the objects to be processed. A first containing portion provided in the transferring chamber is capable of temporarily containing unprocessed objects to be processed for a next thermal process. A second containing portion provided in the transferring chamber is capable of temporarily containing processed objects to be processed conveyed out from the thermal processing furnace. A transferring mechanism transfers objects to be processed between the conveying container, the first containing portion, the second containing portion and the boat.

摘要翻译： 本发明的立式热处理装置包括在其下部具有炉开口的热处理炉。 沿着垂直方向以层状方式保持待加工物体的船适于通过炉开口容纳在热处理炉中。 支撑船的盖子能够关闭炉子开口。 传送室连接到炉口。 设置在传送室中的升降机构被构造成上下移动盖子，以便将船体加载和卸载到热处理炉中。 设置在传送室的壁上的连接口能够连接到用于容纳待处理物体的输送容器的开口。 设置在传送室中的第一容纳部分能够临时包含待处理的待处理物体用于下一个热处理。 设置在传送室中的第二容纳部能够暂时包含从热处理炉输出的被处理物。 传送机构在输送容器，第一容纳部分，第二容纳部分和船之间传送待加工的物体。

公开(公告)号：US5527390A

公开(公告)日：1996-06-18

申请号：US212884

申请日：1994-03-14

申请人： Yuji Ono ,  Katsuhiko Mihara

发明人： Yuji Ono ,  Katsuhiko Mihara

IPC分类号： C23C16/54 ,  H01L21/677 ,  H01L21/687 ,  C23C16/00 ,  B25J11/00 ,  B65G49/07 ,  F27D3/12

CPC分类号： H01L21/67757 ,  C23C16/54 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S414/14

摘要： A treatment system is disclosed, which has a treatment apparatus for performing a predetermined treatment for a planar workpiece contained in a carrier, and a first air-tight carrier storage chamber for storing the carrier. The treatment apparatus has an air-tight second carrier storage chamber. An inert gas supply pipe and an exhaust pipe are connected to each of the treatment apparatus, the first carrier storage chamber, and the second carrier storage chamber. An open/close valve and an open/close device are connected to each of the inert gas supply pipes and the exhaust pipes.

摘要翻译： 公开了一种处理系统，其具有用于对包含在载体中的平面工件进行预定处理的处理装置和用于存储载体的第一气密载体储存室。 处理装置具有气密的第二载体储存室。 惰性气体供给管和排气管连接到处理装置，第一载体储存室和第二载体储存室中的每一个。 每个惰性气体供给管和排气管都连接开/关阀和打开/关闭装置。