公开(公告)号：US07022000B2

公开(公告)日：2006-04-04

申请号：US10993358

申请日：2004-11-22

申请人： Yasutaka Mizomoto ,  Ichiro Yamahata ,  Toshimitsu Goto ,  Masanori Izumita ,  Katsunori Iizuka ,  Shinji Yasuda

发明人： Yasutaka Mizomoto ,  Ichiro Yamahata ,  Toshimitsu Goto ,  Masanori Izumita ,  Katsunori Iizuka ,  Shinji Yasuda

IPC分类号： B24B7/00

CPC分类号： B24B37/345 ,  B24B7/228

摘要： A wafer processing machine comprising a turntable, a plurality of chuck tables mounted on the turntable, a grinding means for grinding a wafer held on the chuck table, and a multipurpose polishing means for polishing the ground surface of a wafer held on a chuck table, wherein the multipurpose polishing means comprises a mounter for detachably mounting a polishing tool, a spindle unit for rotating the mounter, a spindle unit support means for supporting the spindle unit in such a manner that the spindle unit can move in a direction perpendicular to the holding surfaces of the chuck tables and in a direction parallel to the holding surfaces of the chuck tables, a first polishing-feed means for moving the spindle unit in a direction perpendicular to the holding surfaces of the chuck tables, and a second polishing-feed means for moving the spindle unit in a direction parallel to the holding surfaces of the chuck tables.

摘要翻译： 一种晶片加工机，包括转盘，安装在转台上的多个卡盘台，用于研磨夹在夹盘上的晶片的磨削装置，以及用于抛光保持在卡盘台上的晶片的地面的多用途抛光装置， 其特征在于，所述多用途抛光装置包括用于可拆卸地安装抛光工具的安装器，用于旋转所述安装器的主轴单元;主轴单元支撑装置，用于以使所述主轴单元能够沿垂直于所述保持件的方向移动的方式支撑所述主轴单元; 卡盘台的表面和平行于卡盘台的保持表面的方向，用于沿垂直于卡盘台的保持表面的方向移动主轴单元的第一抛光进给装置和第二抛光装置 用于沿平行于卡盘台的保持表面的方向移动主轴单元。

公开(公告)号：US20050118938A1

公开(公告)日：2005-06-02

申请号：US10993358

申请日：2004-11-22

申请人： Yasutaka Mizomoto ,  Ichiro Yamahata ,  Toshimitsu Goto ,  Masanori Izumita ,  Katsunori Iizuka ,  Shinji Yasuda

发明人： Yasutaka Mizomoto ,  Ichiro Yamahata ,  Toshimitsu Goto ,  Masanori Izumita ,  Katsunori Iizuka ,  Shinji Yasuda

IPC分类号： B24B7/24 ,  B24B7/22 ,  B24B37/04 ,  H01L21/304 ,  B24B49/00

CPC分类号： B24B37/345 ,  B24B7/228

摘要： A wafer processing machine comprising a turntable, a plurality of chuck tables mounted on the turntable, a grinding means for grinding a wafer held on the chuck table, and a multipurpose polishing means for polishing the ground surface of a wafer held on a chuck table, wherein the multipurpose polishing means comprises a mounter for detachably mounting a polishing tool, a spindle unit for rotating the mounter, a spindle unit support means for supporting the spindle unit in such a manner that the spindle unit can move in a direction perpendicular to the holding surfaces of the chuck tables and in a direction parallel to the holding surfaces of the chuck tables, a first polishing-feed means for moving the spindle unit in a direction perpendicular to the holding surfaces of the chuck tables, and a second polishing-feed means for moving the spindle unit in a direction parallel to the holding surfaces of the chuck tables.

摘要翻译： 一种晶片加工机，包括转盘，安装在转台上的多个卡盘台，用于研磨夹在夹盘上的晶片的磨削装置，以及用于抛光保持在卡盘台上的晶片的地面的多用途抛光装置， 其特征在于，所述多用途抛光装置包括用于可拆卸地安装抛光工具的安装器，用于旋转所述安装器的主轴单元;主轴单元支撑装置，用于以使所述主轴单元能够沿垂直于所述保持件的方向移动的方式支撑所述主轴单元; 卡盘台的表面和平行于卡盘台的保持表面的方向，用于沿垂直于卡盘台的保持表面的方向移动主轴单元的第一抛光进给装置和第二抛光装置 用于沿平行于卡盘台的保持表面的方向移动主轴单元。