公开(公告)号：US20050286226A1

公开(公告)日：2005-12-29

申请号：US11218151

申请日：2005-08-31

申请人： Hideo Ishii ,  Masao Katooka ,  Kazunori Nakata ,  Yuji Ikejiri

发明人： Hideo Ishii ,  Masao Katooka ,  Kazunori Nakata ,  Yuji Ikejiri

IPC分类号： H02M3/28 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H05K7/20918 ,  H01L2924/00

摘要： A heat-generating component cooling structure includes a hollow heat sink having a portion made of a thermally conductive material. The heat sink has an interior path extending from first to second ends of the heat sink. A fan device is disposed at the first end of the heat sink and is adapted to cause air to flow through the interior path. Fins are disposed in the path in the heat sink. Heat-generating components of an electrical circuit are mounted on an outer surface of the heat sink.

摘要翻译： 发热部件冷却结构包括具有由导热材料制成的部分的中空散热器。 散热器具有从散热器的第一端延伸到第二端的内部路径。 风扇装置设置在散热器的第一端处并且适于使空气流过内部路径。 翅片设置在散热器的路径中。 电路的发热部件安装在散热器的外表面上。

公开(公告)号：US07315450B2

公开(公告)日：2008-01-01

申请号：US11218151

申请日：2005-08-31

申请人： Hideo Ishii ,  Masao Katooka ,  Kazunori Nakata ,  Yuji Ikejiri

发明人： Hideo Ishii ,  Masao Katooka ,  Kazunori Nakata ,  Yuji Ikejiri

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H05K7/20918 ,  H01L2924/00

摘要： A heat-generating component cooling structure includes a hollow heat sink having a portion made of a thermally conductive material. The heat sink has an interior path extending from first to second ends of the heat sink. A fan device is disposed at the first end of the heat sink and is adapted to cause air to flow through the interior path. Fins are disposed in the path in the heat sink. Heat-generating components of an electrical circuit are mounted on an outer surface of the heat sink.

摘要翻译： 发热部件冷却结构包括具有由导热材料制成的部分的中空散热器。 散热器具有从散热器的第一端延伸到第二端的内部路径。 风扇装置设置在散热器的第一端处并且适于使空气流过内部路径。 翅片设置在散热器的路径中。 电路的发热部件安装在散热器的外表面上。

公开(公告)号：US07256994B2

公开(公告)日：2007-08-14

申请号：US11250949

申请日：2005-10-14

申请人： Hideo Ishii ,  Masao Katooka ,  Kazunori Nakata ,  Takeshi Morimoto ,  Yuji Ikejiri

发明人： Hideo Ishii ,  Masao Katooka ,  Kazunori Nakata ,  Takeshi Morimoto ,  Yuji Ikejiri

IPC分类号： H05K7/20

CPC分类号： H05K7/20972 ,  H05K7/20963

摘要： An opening is formed in a case. Air is caused to flow through the interior of the case. A panel closes the opening. A printed circuit board is disposed behind the panel within the case. A plurality of components, including a control device which can be operated on the front surface of the panel and a display device providing a display viewable on the front surface of the panel, are mounted on the printed circuit board. The printed circuit board is enclosed in a closed receptacle disposed within the case.

摘要翻译： 在壳体中形成开口。 使空气流过外壳的内部。 面板关闭开口。 印刷电路板设置在外壳内的面板后面。 包括可以在面板的前表面上操作的控制装置和在面板的前表面上提供可显示的显示装置的多个部件安装在印刷电路板上。 印刷电路板被封闭在设置在壳体内的封闭的容器中。

公开(公告)号：US20070086159A1

公开(公告)日：2007-04-19

申请号：US11250949

申请日：2005-10-14

申请人： Hideo Ishii ,  Masao Katooka ,  Kazunori Nakata ,  Takeshi Morimoto ,  Yuji Ikejiri

发明人： Hideo Ishii ,  Masao Katooka ,  Kazunori Nakata ,  Takeshi Morimoto ,  Yuji Ikejiri

IPC分类号： H05K7/20

CPC分类号： H05K7/20972 ,  H05K7/20963

摘要： An opening is formed in a case. Air is caused to flow through the interior of the case. A panel closes the opening. A printed circuit board is disposed behind the panel within the case. A plurality of components, including a control device which can be operated on the front surface of the panel and a display device providing a display viewable on the front surface of the panel, are mounted on the printed circuit board. The printed circuit board is enclosed in a closed receptacle disposed within the case.