公开(公告)号：US20060113006A1

公开(公告)日：2006-06-01

申请号：US10542029

申请日：2004-01-22

申请人： Akihiro Masuda ,  Masayoshi Kohinata ,  Keigo Obata ,  Masakazu Yoshimoto ,  Kiyotaka Tsuji ,  Ei Uchida ,  Keiji Ori ,  Masahiro Eikawa

发明人： Akihiro Masuda ,  Masayoshi Kohinata ,  Keigo Obata ,  Masakazu Yoshimoto ,  Kiyotaka Tsuji ,  Ei Uchida ,  Keiji Ori ,  Masahiro Eikawa

IPC分类号： C23C22/48

CPC分类号： C25D3/32 ,  C25D3/60 ,  H01L2224/11462

摘要： The present invention provides a tin-containing plating bath comprising: (a) a soluble stannous salt, or a mixture of a soluble stannous salt and at least one soluble salt selected from the group consisting of copper salts, bismuth salts, silver salts, indium salts, zinc salts, nickel salts, cobalt salts and antimony salts; and (b) at least one aliphatic sulfonic acid selected from the group consisting of alkanesulfonic acids and alkanolsulfonic acids, the aliphatic sulfonic acid being a purified aliphatic sulfonic acid in which the total amount of sulfur-containing compounds as impurities consisting of compound(s) containing one or more sulfur atoms with an oxidation number of +4 or less in the molecule and compound(s) containing one or more sulfur atoms and one or more chlorine atoms in the molecule is a minute amount or less. A tin or tin alloy plating film with excellent reflowability, film appearance, etc. can be formed by the use of this plating bath.

摘要翻译： 本发明提供一种含锡电镀液，其包含：（a）可溶性亚锡盐或可溶性亚锡盐与至少一种选自铜盐，铋盐，银盐，铟的可溶性盐的混合物 盐，锌盐，镍盐，钴盐和锑盐; 和（b）选自烷烃磺酸和链烷醇磺酸的至少一种脂族磺酸，所述脂族磺酸是纯化的脂族磺酸，其中作为杂质的含硫化合物的总量由化合物 在分子中含有氧化数为+4以下的一个或多个硫原子，分子中含有一个以上硫原子和一个以上氯原子的化合物为微量以下。 可以通过使用该镀浴形成具有优异的回流性，膜外观等的锡或锡合金电镀膜。