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公开(公告)号:US20070295993A1
公开(公告)日:2007-12-27
申请号:US11564795
申请日:2006-11-29
IPC分类号: H01L29/778 , H01L21/338
CPC分类号: H01L29/7786 , H01L29/2003 , H01L29/66462
摘要: Methods and devices for fabricating AlGaN/GaN normally-off high electron mobility transistors (HEMTs). A fluorine-based (electronegative ions-based) plasma treatment or low-energy ion implantation is used to modify the drain-side surface field distribution without the use of a field plate electrode. The off-state breakdown voltage can be improved and current collapse can be completely suppressed in LDD-HEMTs with no significant degradation in gains and cutoff frequencies.
摘要翻译: 用于制造AlGaN / GaN常关高电子迁移率晶体管(HEMT)的方法和装置。 使用基于氟(电负离子的)等离子体处理或低能离子注入来改变漏极侧表面场分布而不使用场板电极。 可以改善截止状态击穿电压,并且在LDD-HEMT中可以完全抑制电流崩溃,而增益和截止频率没有明显的降低。