公开(公告)号：US06676718B2

公开(公告)日：2004-01-13

申请号：US10005253

申请日：2001-12-04

申请人： Qiuliang Luo ,  Qianqiu Ye ,  Kelly H. Block

发明人： Qiuliang Luo ,  Qianqiu Ye ,  Kelly H. Block

IPC分类号： C09G102

CPC分类号： H01L21/3212 ,  C09G1/02

摘要： According to the invention, an aqueous polishing composition comprises, abrasive particles and water of basic pH to remove a barrier layer by CMP using a polishing pad, the aqueous polishing composition further comprising, solely polar molecules each having multiple, polar bonding sites forming respective hydrogen bonds with silanol bonding groups on a hydrated silica dielectric layer of a semiconductor substrate, which form an hydrophilic protective film of the polar molecules that minimizes erosion.

摘要翻译： 根据本发明，水性抛光组合物包括研磨颗粒和碱性pH值的水以通过使用抛光垫通过CMP去除阻挡层，水性抛光组合物还包括仅具有多个极性键合位点的极性分子，形成相应的氢 在半导体衬底的水合二氧化硅介电层上与硅烷醇键合基团键合，形成最小化侵蚀的极性分子的亲水性保护膜。