公开(公告)号：US06576064B2

公开(公告)日：2003-06-10

申请号：US08891304

申请日：1997-07-10

申请人： Stewart K. Griffiths ,  Robert H. Nilson ,  Kenneth J. Torres

发明人： Stewart K. Griffiths ,  Robert H. Nilson ,  Kenneth J. Torres

IPC分类号： C23C1600

CPC分类号： H01L21/6875 ,  C23C16/4583 ,  H01L21/68757

摘要： A support apparatus for minimizing gravitational stress in semiconductor wafers, and particularly silicon wafers, during thermal processing. The support apparatus comprises two concentric circular support structures disposed on a common support fixture. The two concentric circular support structures, located generally at between 10 and 70% and 70 and 100% and preferably at 35 and 82.3% of the semiconductor wafer radius, can be either solid rings or a plurality of spaced support points spaced apart from each other in a substantially uniform manner. Further, the support structures can have segments removed to facilitate wafer loading and unloading. In order to withstand the elevated temperatures encountered during semiconductor wafer processing, the support apparatus, including the concentric circular support structures and support fixture can be fabricated from refractory materials, such as silicon carbide, quartz and graphite. The claimed wafer support apparatus can be readily adapted for use in either batch or single-wafer processors.

摘要翻译： 一种用于在热处理期间最小化半导体晶片，特别是硅晶片中的重力应力的支撑装置。 支撑装置包括设置在公共支撑夹具上的两个同心的圆形支撑结构。 通常位于半导体晶片半径的10％至70％和70％和100％之间，优选为35％和82.3％的两个同心圆形支撑结构可以是固体环或彼此间隔开的多个间隔开的支撑点 以大致均匀的方式。 此外，支撑结构可以具有去除段以便于晶片加载和卸载。 为了承受半导体晶片加工过程中遇到的高温，包括同心圆形支撑结构和支撑固定装置在内的支撑装置可以由诸如碳化硅，石英和石墨的耐火材料制成。 所要求保护的晶片支撑装置可以容易地适用于批处理或单晶片处理器。