Method of providing bends in electrical leads, and articles made thereby
    1.
    发明授权
    Method of providing bends in electrical leads, and articles made thereby 失效
    在电线中提供弯曲的方法,以及由此制成的制品

    公开(公告)号:US5288943A

    公开(公告)日:1994-02-22

    申请号:US10028

    申请日:1993-01-27

    摘要: The invention minimizes openings or cracks near the position at which a solder tail of a lead frame extends through a wall of a case molded about the lead frame and through which wall the solder tail extends, so as to prevent leakage through the wall near the solder tail. To accomplish this, a double-bend is formed in the solder tail before encapsulation of the lead frame. The double-bend comprises a first downward right-angle bend just outside the case wall, and an adjacent distally-spaced opposite bend such that the distal end portion of the solder tail extends substantially parallel to the plane of the lead frame. Subsequently, an anvil is positioned to support the portion of the lead tail between the case wall and the first downward bend in the solder tail, while a forming tool forces the distal end portion of the soldering tail downward to the desired final position. The final bending occurs primarily around the previously-formed opposite bend, rather than at or immediately adjacent to the case wall, thereby substantially eliminating openings in the molded case body where the solder tail passes through the case wall.

    摘要翻译: 本发明使引线框架的焊尾延伸穿过围绕引线框架模制的壳体的壁的位置附近的开口或裂缝最小化,并且焊尾延伸穿过该壁,以防止通过焊料附近的壁的泄漏 尾巴。 为了实现这一点,在引线框架封装之前,在焊尾中形成双弯。 双弯曲包括刚好在壳体外部的第一向下直角弯曲部和相邻的远离相对的弯曲部,使得焊接尾部的远端部分基本上平行于引线框架的平面延伸。 随后,定位砧以支撑引线尾部在壳体壁与焊尾之间的第一向下弯曲处的部分,而成形工具迫使焊尾的远端部分向下到达期望的最终位置。 最终弯曲主要围绕先前形成的相对弯曲部而不是在壳体壁处或紧邻壳体壁处,从而基本上消除模制壳体中的开口,其中焊尾通过壳体壁。