Organopolysiloxane compositions crosslinkable by ultraviolet light and a
process for encapsulating electronic components
    1.
    发明授权
    Organopolysiloxane compositions crosslinkable by ultraviolet light and a process for encapsulating electronic components 失效
    通过紫外光可交联的有机聚硅氧烷组合物和用于封装电子部件的方法

    公开(公告)号:US4595471A

    公开(公告)日:1986-06-17

    申请号:US762756

    申请日:1985-08-06

    CPC分类号: C08L83/06 C08L83/08 H05K3/287

    摘要: Organopolysiloxane compositions that are crosslinked by ultraviolet light comprising (A) an organopolysiloxane having units of the formulaHR.sup.1 C=CR.sup.2 COOR.sup.3 SiR.sub.2 O.sub.1/2,in which at least two such siloxane units are present per molecule of organopolysiloxane (A) and at least 80 percent of the number of the remaining siloxane units in organopolysiloxane (A) comprise units of the formulaR.sub.2 SiO,where R is a monovalent hydrocarbon radical or a halogenated monovalent hydrocarbon radical, R.sup.1 is hydrogen or a halogenated phenyl radical, R.sup.2 is hydrogen or an alkyl radical having from 1 to 4 carbon atoms per radical and R.sup.3 is a divalent hydrocarbon radical or a halogenated divalent hydrocarbon radical, in which the organopolysiloxane (A) has an average viscosity of from 20 to 5000 mPa.s at 25.degree. C., (B) an organopolysiloxane terminated by units of the formula R.sub.3 SiO.sub.178 , and having from 0.05 to 5 mole percent of units of the formula ##EQU1## wherein R and R.sup.3 are the same as above and a is 0 or 1, and at least 99 mole percent of the remaining siloxane units, other than the triorganosiloxy groups, comprise units of the formulaR.sub.2 SiO,where R is the same as above, in which organopolysiloxane (B) has an average viscosity of from 50 to 2000 mPa.s at 25.degree. C., and (C) a photosensitizer, in which Si-bonded hydroxy groups that are present in units of the formulaR.sub.2 SiOare present in an amount which does not exceed 0.2 hydroxy groups per group of the formulaHR.sub.1 C=CR.sup.2 COOR.sup.3 --,and a total of at most 0.02 percent by weight, based on the total weight of the organopolysiloxane (A), organopolysiloxane (B) and photosensitizer (C), of organic titanium or organic tin compounds are present in the compositions. These crosslinkable compositions are useful for encapsulating electronic components.

    摘要翻译: 通过紫外光交联的有机聚硅氧烷组合物包含(A)具有式HR1C = CR2COOR3SiR2O1 / 2的单元的有机聚硅氧烷,其中每分子有机聚硅氧烷(A)存在至少两个这样的硅氧烷单元和至少80%的数目 的有机聚硅氧烷(A)中的剩余硅氧烷单元包含式R 2 SiO的单元,其中R是一价烃基或卤代一价烃基,R 1是氢或卤代苯基,R 2是氢或具有1 至4个碳原子,R 3是二价烃基或卤代二价烃基,其中有机聚硅氧烷(A)在25℃下的平均粘度为20-5000mPa.s,(B)有机聚硅氧烷 由式R3SiO178的单元终止,并且具有0.05至5摩尔%的式“IMAGE”的单元,其中R和R3与上述相同,a是0或1,a 除了三有机甲硅烷氧基之外,其余硅氧烷单元的至少99摩尔%包含式R 2 SiO的单元,其中R与上述相同,其中有机聚硅氧烷(B)的平均粘度为50-2000mPa.s 在25℃下,和(C)光敏剂,其中以式R2SiO为单位存在的与Si键合的羟基以不超过0.2个羟基的量存在,式为HR1C = CR2COOR3- ,有机钛或有机锡化合物的有机聚硅氧烷(A),有机聚硅氧烷(B)和光敏剂(C)的总重量,总计最多为0.02重量%。 这些可交联组合物可用于封装电子部件。