公开(公告)号：US20060056945A1

公开(公告)日：2006-03-16

申请号：US11161495

申请日：2005-08-05

申请人： Koji DAIO

发明人： Koji DAIO

IPC分类号： B65G65/04

CPC分类号： H05K13/021

摘要： An object of the present invention is to minimize a fear of damaging parts when they are transferred from a carry-in cassette to a carry-out cassette and to shorten a transferring time. Tip end portions of a thrusting-down pin 30 and a suction collet 50 are brought into contact with a back face of an adhesive sheet 11 of a carry-in cassette 10 to thrust down a semiconductor chip 1 and the thrust-down semiconductor chip 1 is received on a carry-out cassette 20A, 20B, or 20C and stuck on an adhesive sheet 21A, 21B, or 21C of a receiving face 201A, 201B, or 201C of the carry out cassette 20A, 20B, or 20C.

摘要翻译： 本发明的一个目的是在将零件从携带盒传送到承载盒并且缩短传送时间时，最大限度地减少损坏零件的恐惧。 推压销30和吸入夹头50的前端部与携带盒10的粘合片11的背面接触，以推挤半导体芯片1和推力下降半导体芯片1 被接收在输出盒20A，20B或20C上，并被粘贴在进纸盒的接收面201A，201B或201C的粘合片21A，21B或21C上 20 A，20 B或20 C.