摘要:
A planarizing material comprising a resin capable of having its practical temperature for a planarizing step set at a level lower than 200.degree. C., and a melamine-type heat-curing agent and/or an epoxy-type heat-curing agent.
摘要:
A photoresist composition comprising:a resin soluble in an aqueous alkaline solution, having units of an aliphatic cyclic hydrocarbon main frame and units derived from maleic anhydride and/or units derived from a maleimide; anda photosensitive agent in a sufficient amount to promote or hinder the solubility of said resin in an aqueous alkaline solution upon exposure to active radiation so as to create a substantial difference in the solubility as between an exposed portion and a non-exposed portion and to form a positive or negative image by subsequent development with an aqueous alkaline solution.