公开(公告)号：US08460478B2

公开(公告)日：2013-06-11

申请号：US11754843

申请日：2007-05-29

申请人： Kuang-Nian Tang ,  Yang-Kai Fan ,  Yu-Sheng Su ,  Ming-Tsao Chiang ,  Yu-Cheng Shih

发明人： Kuang-Nian Tang ,  Yang-Kai Fan ,  Yu-Sheng Su ,  Ming-Tsao Chiang ,  Yu-Cheng Shih

IPC分类号： B08B3/00

CPC分类号： H01L21/67023 ,  H01L21/67057

摘要： A semiconductor apparatus includes a first tank configured to accommodate a first fluid. A second tank is configured to receive overflow of the first fluid into an upper portion of the second tank and to accommodate a second fluid. A cycling system including a first conduit is configured between the first tank and the second tank. The first conduit has an end substantially below a surface of the second fluid. A fluid providing system including a second conduit is fluidly coupled to the second tank and configured to provide the second fluid into the second tank. The second conduit has an end substantially below the surface of the second fluid. An overflow system is coupled to the second tank and configured to remove an upper portion of the second fluid when the surface of the second fluid is substantially equal to or higher than a pre-determined level.

摘要翻译： 半导体装置包括配置成容纳第一流体的第一罐。 第二罐被配置为接收第一流体溢流到第二罐的上部并容纳第二流体。 包括第一管道的循环系统配置在第一罐和第二罐之间。 第一导管具有基本上低于第二流体表面的端部。 包括第二导管的流体提供系统流体地联接到第二罐并且被配置为将第二流体提供到第二罐中。 第二导管具有基本上低于第二流体表面的端部。 溢流系统联接到第二罐，并且构造成当第二流体的表面基本上等于或高于预定水平时，去除第二流体的上部。

公开(公告)号：US20080295874A1

公开(公告)日：2008-12-04

申请号：US11754843

申请日：2007-05-29

申请人： Kuang-Nian Tang ,  Yang-Kai Fan ,  Yu-Sheng Su ,  Ming-Tsao Chiang ,  Yu-Cheng Shih

发明人： Kuang-Nian Tang ,  Yang-Kai Fan ,  Yu-Sheng Su ,  Ming-Tsao Chiang ,  Yu-Cheng Shih

IPC分类号： B08B3/10

CPC分类号： H01L21/67023 ,  H01L21/67057

摘要： A semiconductor apparatus includes a first tank configured to accommodate a first fluid. A second tank is configured to receive overflow of the first fluid into an upper portion of the second tank and to accommodate a second fluid. A cycling system including a first conduit is configured between the first tank and the second tank. The first conduit has an end substantially below a surface of the second fluid. A fluid providing system including a second conduit is fluidly coupled to the second tank and configured to provide the second fluid into the second tank. The second conduit has an end substantially below the surface of the second fluid. An overflow system is coupled to the second tank and configured to remove an upper portion of the second fluid when the surface of the second fluid is substantially equal to or higher than a pre-determined level.

摘要翻译： 半导体装置包括配置成容纳第一流体的第一罐。 第二罐被配置为接收第一流体溢流到第二罐的上部并容纳第二流体。 包括第一管道的循环系统配置在第一罐和第二罐之间。 第一导管具有基本上低于第二流体表面的端部。 包括第二导管的流体提供系统流体地联接到第二罐并且被配置为将第二流体提供到第二罐中。 第二导管具有基本上低于第二流体表面的端部。 溢流系统联接到第二罐，并且构造成当第二流体的表面基本上等于或高于预定水平时，去除第二流体的上部。