公开(公告)号：US4885837A

公开(公告)日：1989-12-12

申请号：US284724

申请日：1988-12-15

申请人： Taizo Eshima ,  Kunihiro Yasutake ,  Katuhiko Yamasaki

发明人： Taizo Eshima ,  Kunihiro Yasutake ,  Katuhiko Yamasaki

IPC分类号： H01L21/00 ,  H05K13/00

CPC分类号： H01L21/67144 ,  H05K13/0092 ,  Y10T29/49121 ,  Y10T29/5136

摘要： An apparatus for forming leads of semiconductor devices includes a tie-bar cutting device for cutting tie-bars connecting adjacent leads in a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing, a resin-burr removing device for removing resin burrs from the lead frame whose tie-bars have been cut, and a bending device for bending the leads of the lead frame whose resin burrs have been removed. After tie-bars are cut from a lead frame on which semiconductor chips are mounted, resin burrs are removed from the lead frame and the leads of the lead frame are bent.

摘要翻译： 一种用于形成半导体器件的引线的装置包括：一个连接杆切割装置，用于切割连接半导体芯片安装在其中的引线框架中的相邻引线的连接杆，并且由于树脂密封而具有不希望的树脂毛刺; 用于从已经切断了拉杆的引线框架中除去树脂毛刺的毛刺去除装置，以及用于弯曲引线框架的引线的弯曲装置，其中树脂毛刺已经被去除。 在从安装有半导体芯片的引线框架切下连接条之后，从引线框架去除树脂毛刺，引线框架的引线弯曲。