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    Apparatus for forming leads of semiconductor devices
    1.
    发明授权
    Apparatus for forming leads of semiconductor devices 失效
    用于形成半导体器件引线的装置

    公开(公告)号：US4885837A

    公开(公告)日：1989-12-12

    申请号：US284724

    申请日：1988-12-15

    申请人： Taizo Eshima ,  Kunihiro Yasutake ,  Katuhiko Yamasaki

    发明人： Taizo Eshima ,  Kunihiro Yasutake ,  Katuhiko Yamasaki

    IPC分类号： H01L21/00 ,  H05K13/00

    CPC分类号： H01L21/67144 ,  H05K13/0092 ,  Y10T29/49121 ,  Y10T29/5136

    摘要： An apparatus for forming leads of semiconductor devices includes a tie-bar cutting device for cutting tie-bars connecting adjacent leads in a lead frame on which semiconductor chips are mounted and which has unwanted resin burrs as a result of resin-sealing, a resin-burr removing device for removing resin burrs from the lead frame whose tie-bars have been cut, and a bending device for bending the leads of the lead frame whose resin burrs have been removed. After tie-bars are cut from a lead frame on which semiconductor chips are mounted, resin burrs are removed from the lead frame and the leads of the lead frame are bent.

    摘要翻译： 一种用于形成半导体器件的引线的装置包括：一个连接杆切割装置，用于切割连接半导体芯片安装在其中的引线框架中的相邻引线的连接杆，并且由于树脂密封而具有不希望的树脂毛刺; 用于从已经切断了拉杆的引线框架中除去树脂毛刺的毛刺去除装置，以及用于弯曲引线框架的引线的弯曲装置，其中树脂毛刺已经被去除。 在从安装有半导体芯片的引线框架切下连接条之后，从引线框架去除树脂毛刺，引线框架的引线弯曲。

    Method of cleaning semiconductor molding apparatus
    2.
    发明授权
    Method of cleaning semiconductor molding apparatus 失效
    半导体成型装置的清洗方法

    公开(公告)号：US5053172A

    公开(公告)日：1991-10-01

    申请号：US582101

    申请日：1990-09-14

    申请人： Katuhiko Yamasaki ,  Minoru Tanaka ,  Kenichiro Sakamoto

    发明人： Katuhiko Yamasaki ,  Minoru Tanaka ,  Kenichiro Sakamoto

    IPC分类号： B29C33/72

    CPC分类号： B29C33/72

    摘要： A molding apparatus has a fixed upper platen and a movable lower platen on which are secured an upper and a lower mold half, respectively. A cleaning device for cleaning the mold surfaces of the mold halves is installed on the upper platen, and the lower platen is open so that foreign matter will not accumulate atop it.

    摘要翻译： 模制装置具有固定的上压板和可移动的下压板，在其上分别固定有上半模和下半模。 用于清洁半模的模具表面的清洁装置安装在上压板上，并且下压板打开，使得异物不会堆积在其上。