公开(公告)号：US20060128271A1

公开(公告)日：2006-06-15

申请号：US10529742

申请日：2004-04-23

申请人： Hiroshi Shiho ,  Yukio Hosaka ,  Kuo Hasegawa ,  Nobuo Kawahashi

发明人： Hiroshi Shiho ,  Yukio Hosaka ,  Kuo Hasegawa ,  Nobuo Kawahashi

IPC分类号： B24B49/00 ,  B24B1/00 ,  B24B7/30

CPC分类号： B24B37/205

摘要： An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoint detection without lowering the polishing performance as well as methods for polishing of a semiconductor wafer using them. The polishing pad of the present invention comprises a substrate 11 for a polishing pad provided with a through hole penetrating from surface to back, a light transmitting part 12 fitted in the through hole, the light transmitting part comprises a water-insoluble matrix material (1,2-polybutadiene) and a water-soluble particle (β-cyclodextrin) dispersed in the water-insoluble matrix material, and the water-soluble particle is less than 5% by volume based on 100% by volume of the total amount of the water-insoluble matrix material and the water-soluble particle. In addition, the laminated body for polishing of the present invention comprises a supporting layer on a backside of the polishing pad. These polishing pad and laminated body for polishing can comprise a fixing layer 13 on a backside.

摘要翻译： 本发明的目的是提供一种用于半导体晶片的抛光垫和用于抛光配备有该半导体晶片的半导体晶片的半导体晶片的层叠体，其可以在不降低抛光性能的情况下进行光学终点检测以及半导体的抛光方法 晶圆使用它们。 本发明的抛光垫包括用于抛光垫的基板11，该抛光垫具有从表面向后穿透的通孔，安装在通孔中的透光部12，透光部包括水不溶性基质材料（1 ，2-聚丁二烯）和分散在水不溶性基质材料中的水溶性颗粒（β-环糊精），并且水溶性颗粒的体积百分比小于5体积％ 水不溶性基质材料和水溶性颗粒。 另外，本发明的研磨用层叠体在研磨垫的背面具有支撑层。 这些抛光垫和用于抛光的层压体可以在背面上包括固定层13。