Abstract:
A probing apparatus comprises a wafer chuck configured to receive a semiconductor wafer having a plurality of integrated circuit devices and test keys configured to monitor the fabrication quality of the integrated circuit devices, a carrier configured to receive a probe card having a plurality of probe needles configured to contact the test keys of the semiconductor wafer and collect electrical information of the integrated circuit devices, and an angular adjusting module configured to adjust the angle between the probe card and the semiconductor wafer by rotating the semiconductor wafer.
Abstract:
A display replicate construct applied in portable information device discloses that the internal or external of an information device is installed with a connector to expand the display efficiency of the display module in the information device internally or externally. Therefore, the information device with low resolution display processing device can be linked to a high resolution display processing module by the connector, and via a switching module, the information device can manage the function of switching the two display processing modules as well so as to achieve the purpose of expanding the display efficiency of information device.