公开(公告)号：US20240264225A1

公开(公告)日：2024-08-08

申请号：US18641453

申请日：2024-04-22

申请人： United Semiconductor Japan Co., Ltd.

发明人： Yasunobu Torii

IPC分类号： G01R31/28 ,  G01B7/00 ,  G01R1/073

CPC分类号： G01R31/2891 ,  G01B7/003 ,  G01R1/07307

摘要： A probe position monitoring structure includes a first common line, a second common line, a contact portion configured, and a reference zigzag structure. The contact portion includes a first zigzag structure, a second zigzag structure, a third zigzag structure, and a fourth zigzag structure. A first end of the first zigzag structure, a first end of the fourth zigzag structure, and a first end of the reference zigzag structure are directly connected with the first common line. A first end of the second zigzag structure, a first end of the third zigzag structure, and a second end of the reference zigzag structure are directly connected with the second common line. The reference zigzag structure is disposed between the first zigzag structure and the second zigzag structure. A line width of the reference zigzag structure is equal to a line width of the first zigzag structure.

公开(公告)号：US20240255571A1

公开(公告)日：2024-08-01

申请号：US18421446

申请日：2024-01-24

申请人： Xallent Inc.

发明人： Kwame Amponsah ,  Pardeep Kumar

IPC分类号： G01R31/28 ,  G01R1/073

CPC分类号： G01R31/2887 ,  G01R1/07307 ,  G01R31/2891

摘要： Micro and nanoscale probes are used in the semiconductor and thin film materials industries to test wafers and samples. Probes supply and measure signals to and from the sample. Signals could be electrical, mechanical, chemical, optical, or photonics. Techniques of capacitance response signal, intensity response signal, photocurrent response signal, piezoresistance response signal, a high frequency response signal, elongated image response signal, contrast response signal, electrical response signal, resonance response signal, current response signal, and/or current-in-plane response signal could be used to determine when the probe tips are in proximity or contact a sample surface.

公开(公告)号：US12007413B2

公开(公告)日：2024-06-11

申请号：US18527013

申请日：2023-12-01

申请人： Tokyo Seimitsu Co., Ltd.

发明人： Tetsuo Yoshida ,  Shunsuke Otake ,  Tatsuya Matsuoka

IPC分类号： G01R31/28 ,  G01R1/067 ,  G01R1/073 ,  H01L21/67 ,  H01L21/687

CPC分类号： G01R1/07307 ,  G01R1/0675 ,  G01R31/2887 ,  G01R31/2889 ,  G01R31/2891 ,  H01L21/67248 ,  H01L21/68707

摘要： A prober controlling device for bringing probe needles into contact with semiconductor chips, includes an input data acquiring unit configured to acquire input data including temperature data of at least one of a probe card and a card holder, a predicting unit configured to predict a position of a tip end of a probe needle based on the input data acquired by the input data acquiring unit, using a prediction model that receives input of the input data and outputs the position of the tip end of the probe needle, and a determining unit configured to determine whether or not to execute prediction by the predicting unit, based on input data used as teacher data for machine learning of the prediction model and the input data acquired by the input data acquiring unit, before the prediction by the predicting unit.

公开(公告)号：US11994555B2

公开(公告)日：2024-05-28

申请号：US17460205

申请日：2021-08-28

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Yuan-Chun Wu ,  Chang-Chun Xu ,  Ni Shen

IPC分类号： G01R31/28 ,  H01L21/66

CPC分类号： G01R31/2891 ,  G01R31/2831 ,  G01R31/2884 ,  H01L22/34

摘要： A probe card includes a circuit board, a fixing member, and a plurality of probes. The fixing member is fixed on the circuit board and has a through opening therein. The fixing member has opposite first and second sidewalls defining the through opening. Each of the probes includes an arm portion and a tip portion. One end of the arm portion is connected to the circuit board. The tip portion extends from the arm portion. The arm portions of the probes extend in substantially a same direction inclined to a direction perpendicular to the first sidewall of the fixing member in a top view.

公开(公告)号：US20240125847A1

公开(公告)日：2024-04-18

申请号：US18471270

申请日：2023-09-20

申请人： MACOM Technology Solutions Holdings, Inc.

发明人： Timothy James VANDERWERF ,  Alex G CHERNYAKOV

IPC分类号： G01R31/28 ,  G01R1/067 ,  G01R1/073

CPC分类号： G01R31/2887 ,  G01R1/06722 ,  G01R1/06733 ,  G01R1/07392 ,  G01R31/2891 ,  G01R31/2831

摘要： Aspects of the present disclosure describe a voice coil actuated leaf spring prober that advantageously may be operated to probe every individual device (device under test—DUT) comprising a contemporary wafer. The prober according to aspects of the present disclosure includes one or more probe needles attached in an electrically isolated arrangement to an end of a horizontal-U-shaped, recurved, leaf spring arrangement. The prober includes—for example—a voice coil actuator positioned within the horizontal-U-shaped portion of the leaf spring which—when operated—results in leaf spring displacement and probe needle movement such that it may mechanically/electrically contact the DUT.

公开(公告)号：US11940482B2

公开(公告)日：2024-03-26

申请号：US17785920

申请日：2020-12-01

申请人： NIDEC READ CORPORATION

发明人： Takashi Isa

IPC分类号： G01R31/28

CPC分类号： G01R31/2808 ,  G01R31/2887 ,  G01R31/2891 ,  G01R31/2893

摘要： An upper mechanism including a table provided with a placement surface of an inspection target, a lower mechanism configured to rotatably support the upper mechanism, and a lifting operation unit configured to be supported by the upper mechanism so as to be movable up and down are provided. The lower mechanism includes a rotation drive unit configured to rotate the upper mechanism, and a push-up force output unit configured to lift and lower the lifting operation unit. A transmission member with which a tip of the push-up force output unit can contact or separate is provided at a lower end of the lifting operation unit.

公开(公告)号：US11828796B1

公开(公告)日：2023-11-28

申请号：US18311164

申请日：2023-05-02

申请人： AEM Holdings Ltd.

发明人： Carl L. Ostrowski ,  Terry Sinclair Connacher

IPC分类号： G01R31/28

CPC分类号： G01R31/2875 ,  G01R31/2891

摘要： Disclosed herein is an integrated heater and measurement (IHM) device comprising heating-sensing element(s) and heating-sensing circuit(s). A heating-sensing element generates heat and determines the temperature of the IHM device. In some embodiments, the heating-sensing element may operate in a plurality of modes: heating mode, sensing mode, and/or off mode. A controller may dynamically adjust the properties of the operation mode and/or time periods based on the determined temperature. The adjusted properties may include the duration of the heating mode, the ON time for a heating-sensing element, etc. The controller may adjust the duration of heating mode based on the temperature difference between the determined temperature and a set point temperature, such as decreasing the duration of the heating mode when there is a low temperature difference, and increasing the duration of the heating mode when there is a high temperature difference.

公开(公告)号：US11796590B2

公开(公告)日：2023-10-24

申请号：US17536211

申请日：2021-11-29

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Pablo Nieves ,  Kushagra Sinha ,  Reinaldo Vega

IPC分类号： G01R31/28 ,  H01L21/66 ,  G01R31/319

CPC分类号： G01R31/2891 ,  G01R31/2884 ,  G01R31/31905 ,  H01L22/34

摘要： A system includes probe pins each including a probe tip and a plurality of thermocouples arranged such that at least one thermocouple is positioned between a pair of the probe pins. The plurality of thermocouples can be placed adjacent or above a device under test (DUT). The probe tips of the probe pins are placed over a plurality of pads. The plurality of thermocouples are placed adjacent or between the plurality of pads. The at least one thermocouple positioned between the pair of the probe pins can be either a single thermocouple or a thermocouple array.

公开(公告)号：US11774486B2

公开(公告)日：2023-10-03

申请号：US17853832

申请日：2022-06-29

申请人： Delta Design, Inc.

发明人： Jerry Ihor Tustaniwskyj ,  Steve Wetzel

IPC分类号： G01R31/02 ,  G01R31/26 ,  H01L23/46 ,  G01R31/28 ,  H01L21/66

CPC分类号： G01R31/2642 ,  G01R31/2831 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2891 ,  H01L23/46 ,  H01L22/34 ,  H01L2924/00 ,  H01L2924/0002

摘要： A method for controlling temperature in a temperature control system. The method includes providing a temperature control system including a controller, a first contactor assembly having a first channel system, a plurality of first contacts, each of the first contacts including a portion that is disposed within the first channel system, and one or more of a first exhaust valve or a first inlet valve, and a second contactor assembly having a second channel system, a plurality of second contacts, each of the second contacts including a portion that is disposed within the second channel system, and one or more of a second exhaust valve or a second inlet valve. The method also includes receiving, by the first contactor assembly, a fluid at a first temperature. The method also includes receiving, by the second contactor assembly, the fluid at the first temperature.

公开(公告)号：US11747394B1

公开(公告)日：2023-09-05

申请号：US17690646

申请日：2022-03-09

申请人： NANYA TECHNOLOGY CORPORATION

发明人： Yi-Ju Chen ,  Jui-Hsiu Jao

IPC分类号： G01R31/26 ,  G01R31/28 ,  G01R1/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073

CPC分类号： G01R31/2887 ,  G01R31/2891

摘要： A probe apparatus includes a chuck configured to support a wafer, a track surrounding the chuck, a tester disposed on the track and having a probe. The tester is configured to move around the wafer along a circumferential direction. The probe apparatus also includes a processing unit in communication with the tester and configured to control a movement of the tester.