WAFER PROTECTION SYSTEM EMPLOYED IN CHEMICAL STATIONS
    1.
    发明申请
    WAFER PROTECTION SYSTEM EMPLOYED IN CHEMICAL STATIONS 审中-公开
    化工站采用的防护系统

    公开(公告)号:US20080053491A1

    公开(公告)日:2008-03-06

    申请号:US11930137

    申请日:2007-10-31

    IPC分类号: B08B3/06

    CPC分类号: C23F1/32 B08B3/04 G03F7/42

    摘要: Semiconductor wafers have ashed photoresist residue and/or post-etch residue thereon to be cleaned through the chemical wet station, and a pattern of exposed metal layer. Post-etch residue removing solvent such as EKC-270 is fed into the solvent tank through a first solvent valve and first liquid feeding conduit that connected to bottom of the solvent tank. A circulation conduit connects the solvent tank with the first liquid feeding conduit for circulating the post-etch residue removing solvent. A liquid feeding pump is connected with the first liquid feeding conduit. A liquid drain conduit and a drain valve are connected with bottom of the solvent tank. Replacement solvent such as EKC-800 is fed into the solvent tank through a second solvent valve and second liquid feeding conduit.

    摘要翻译: 半导体晶片将其上的光致抗蚀剂残留物和/或蚀刻后剩余物残留在化学湿站上,以及暴露的金属层的图案。 蚀刻后残留物除去溶剂如EKC-270通过连接到溶剂罐底部的第一溶剂阀和第一液体供给导管进料到溶剂罐中。 循环管道将溶剂罐与第一液体供给管道连接,以循环蚀刻后残留物去除溶剂。 液体供给泵与第一供液管连接。 液体排放管道和排水阀与溶剂罐的底部连接。 替代溶剂如EKC-800通过第二溶剂阀和第二液体供给导管进料到溶剂罐中。

    WAFER PROTECTION SYSTEM EMPLOYED IN CHEMICAL STATIONS
    2.
    发明申请
    WAFER PROTECTION SYSTEM EMPLOYED IN CHEMICAL STATIONS 审中-公开
    化工站采用的防护系统

    公开(公告)号:US20070044817A1

    公开(公告)日:2007-03-01

    申请号:US11162146

    申请日:2005-08-30

    IPC分类号: C23G1/00 B08B3/00 B08B3/12

    CPC分类号: C23F1/32 B08B3/04 G03F7/42

    摘要: Semiconductor wafers have ashed photoresist residue and/or post-etch residue thereon to be cleaned through the chemical wet station, and a pattern of exposed metal layer. Post-etch residue removing solvent such as EKC-270 is fed into the solvent tank through a first solvent valve and first liquid feeding conduit that connected to bottom of the solvent tank. A circulation conduit connects the solvent tank with the first liquid feeding conduit for circulating the post-etch residue removing solvent. A liquid feeding pump is connected with the first liquid feeding conduit. A liquid drain conduit and a drain valve are connected with bottom of the solvent tank. Replacement solvent such as EKC-800 is fed into the solvent tank through a second solvent valve and second liquid feeding conduit.

    摘要翻译: 半导体晶片将其上的光致抗蚀剂残留物和/或蚀刻后剩余物残留在化学湿站上,以及暴露的金属层的图案。 蚀刻后残留物除去溶剂如EKC-270通过连接到溶剂罐底部的第一溶剂阀和第一液体供给导管进入溶剂罐。 循环管道将溶剂罐与第一液体供给管道连接,以循环蚀刻后残留物去除溶剂。 液体供给泵与第一供液管连接。 液体排放管道和排水阀与溶剂罐的底部连接。 替代溶剂如EKC-800通过第二溶剂阀和第二液体供给导管进料到溶剂罐中。