公开(公告)号：US08987030B2

公开(公告)日：2015-03-24

申请号：US12856101

申请日：2010-08-13

申请人： Peter V. Loeppert ,  Denise P. Czech ,  Lawrence A. Grunert ,  Kurt B. Friel ,  Qing Wang

发明人： Peter V. Loeppert ,  Denise P. Czech ,  Lawrence A. Grunert ,  Kurt B. Friel ,  Qing Wang

IPC分类号： H01L29/10 ,  H01L21/56 ,  B81B7/00

CPC分类号： H01L21/56 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method is provided for manufacturing a plurality of packages. The method comprises the steps of: applying a means for adhering two or more covers to a substrate; positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate; coupling the covers to the substrate; depositing a material into the one or more channels; performing a process on the material to affix the material; and singulating along the channels to create the plurality of packages.

摘要翻译： 提供了一种用于制造多个包装件的方法。 该方法包括以下步骤：施加用于将两个或更多个盖粘合到基底上的装置; 将两个或更多个盖定位到基板上以产生由两个或更多个盖和基板界定的一个或多个通道; 将盖连接到基板; 将材料沉积到所述一个或多个通道中; 在材料上执行一个过程来贴上材料; 并且沿着所述通道分割以创建所述多个包。

公开(公告)号：US07257281B2

公开(公告)日：2007-08-14

申请号：US10462447

申请日：2003-06-16

申请人： Leonard J. Wardzala ,  Gregory A. Ballard ,  Kurt B. Friel

发明人： Leonard J. Wardzala ,  Gregory A. Ballard ,  Kurt B. Friel

IPC分类号： G02B6/12 ,  G02B6/00 ,  B23P17/00

CPC分类号： H05K3/368 ,  G02B6/4228 ,  H01L21/4857 ,  H01L21/4867 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1291 ,  H05K3/321 ,  H05K2203/1126 ,  Y10T29/49812

摘要： A method for fabricating thick film alumina structures used in high frequency, low loss applications is provided. More particularly, the invention is directed to a co-fire process for fabricating, or laminating, thick film structures to one another by printing a conductor layer between two thick film circuits, drying the layer, and co-firing the combined structure. This process is particularly useful in fabricating high frequency (e.g. 10 gigabit) fiber optic transmitters.

公开(公告)号：US20110039372A1

公开(公告)日：2011-02-17

申请号：US12856101

申请日：2010-08-13

申请人： Peter V. Loeppert ,  Denise P. Czech ,  Lawrence A. Grunert ,  Kurt B. Friel ,  Qing Wang

发明人： Peter V. Loeppert ,  Denise P. Czech ,  Lawrence A. Grunert ,  Kurt B. Friel ,  Qing Wang

IPC分类号： H01L21/78

CPC分类号： H01L21/56 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method is provided for manufacturing a plurality of packages. The method comprises the steps of: applying a means for adhering two or more covers to a substrate; positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate; coupling the covers to the substrate; depositing a material into the one or more channels; performing a process on the material to affix the material; and singulating along the channels to create the plurality of packages.

摘要翻译： 提供了一种用于制造多个包装件的方法。 该方法包括以下步骤：施加用于将两个或更多个盖粘合到基底上的装置; 将两个或更多个盖定位到基板上以产生由两个或更多个盖和基板界定的一个或多个通道; 将盖连接到基板; 将材料沉积到所述一个或多个通道中; 在材料上执行一个过程来贴上材料; 并且沿着所述通道分割以创建所述多个包。